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作 者:刘磊 马方方 夏彬 曲云鹏 Lei Liu;Fangfang Ma;Bin Xia;Yunpeng Qu(Institute of Logistics Science and Technology,Academy of Military Sciences,Beijing 100071,China;Chengdu Sichuan University Technology Transfer Group Co.,Ltd,Chengdu 610065,China)
机构地区:[1]军事科学院系统工程研究院,北京100071 [2]成都川大技术转移集团有限公司,四川成都610065
出 处:《高分子材料科学与工程》2023年第11期75-81,共7页Polymer Materials Science & Engineering
摘 要:为满足聚醚醚酮(PEEK)特种封装塑料在特殊环境中应用的高耐热性、高力学性能和透波性能等需求,通过分别将玻璃纤维(GF)和碳化硅纤维(SiC)经熔融共混的方式引入PEEK中,并采用注塑成型的方式制备PEEK复合材料;使用扫描电子显微镜、差示量热扫描仪、万能拉力试验仪、热重分析仪和矢量分析仪对复合材料的拉伸断裂面形貌结构、熔融和结晶行为、力学性能、热稳定性以及电磁屏蔽性能等特性进行了深入研究。结果表明,SiC纤维与PEEK基体具有良好的界面相容性,PEEK/SiC复合材料的力学性能较PEEK/GF复合材料更为优异,其拉伸断裂强度和模量及冲击强度分别可达130.4 MPa,7.39 GPa和14.8 kJ/m^(2),比纯PEEK分别提高了67%,347%和143%。此外,PEEK/SiC复合材料还表现出优异的热稳定性和良好的透波性能。研究结果说明,小尺寸SiC纤维填充PEEK复合材料具有更优的力学性能、耐热性能和透波性能。为在极端环境中应用的电子封装材料的研究与开发提供了有益的思路。In order to meet the requirements of high heat resistance,high mechanical properties and wave permeability of polyetheretherketone(PEEK)special packaging plastics used in special environments,in this paper,glass fibers(GF)and silicon carbide fibers(SiC)were introduced into PEEK by melt blending,and the PEEK composites were prepared by injection molding.The tensile fracture surface morphologies,melting and crystallization behavior,mechanical properties,thermal stability and electromagnetic shielding properties of the composites were studied through electronic scanning microscopy,differential scanning calorimeter,universal testing machine,thermogravimetric analyzer and vector network analyzer.The results show that SiC fiber has good interfacial compatibility with the PEEK matrix,and the mechanical properties of PEEK/SiC composites are better than those of PEEK/GF composites.The tensile breaking strength,modulus and impact strength can reach 130.4 MPa,7.39 GPa and 14.8 kJ/m^(2),respectively,which are 67%,347%and 143%higher than those of pure PEEK.In addition,the PEEK/SiC composites also exhibit excellent thermal stability and good wave permeability.The research results indicate that small size SiC fiber endows PEEK/SiC composites with higher mechanical performance,thermal resistance and wave transmission performance compared with PEEK/GF composites,which provide useful ideas for the research and development of electronic packaging materials used in extreme environment.
关 键 词:聚醚醚酮 玻璃纤维 碳化硅纤维 力学性能 耐热性能 透波性能
分 类 号:TB332[一般工业技术—材料科学与工程]
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