工程陶瓷引弧微爆炸加工边缘碎裂的周向包封研究  

Study on Circumferential Wrapping of Edge Chipping During Engineering Ceramics Machined by MDSAM

作　　者：张保国 姚方周 ZHANG Bao-guo;YAO Fang-zhou(Wuzhen Laboratory,Jiaxing 314500,China;Center of Advanced Ceramic Materials and Devices,YangtzeDelta Region Institute of Tsinghua University,Zhejiang,Jiaxing 314006,China)

机构地区：[1]乌镇实验室,浙江嘉兴314500 [2]浙江清华长三角研究院先进陶瓷材料与器件研究中心,浙江嘉兴314006

出　　处：《机械工程与自动化》2024年第2期1-3,6,共4页Mechanical Engineering & Automation

基　　金：国家重点研发计划项目(2021YFB2012502);国家自然科学基金资助项目(U22A20254)。

摘　　要：针对工程陶瓷引弧微爆炸加工时的边缘碎裂现象,提出了一种利用低熔点金属周向包封施加预应力控制陶瓷材料加工边缘碎裂的方法。介绍了周向包封工艺,开展了包封后工件的引弧微爆炸加工实验,并通过有限元方法对工程陶瓷包封过程中的温度场及应力场进行了仿真,揭示了周向包封控制工程陶瓷引弧微爆炸加工边缘碎裂的机理。Aiming at the edge chipping phenomenon during engineering ceramics machined by Micro-Detonation of Striking Arc Machining(MDSAM),a technology named circumferential wrapping applying pre-stress with low melting point metal is developed to reduce the edge chipping.The circumferential wrapping process was introduced,and the wrapped workpiece was machined by MDSAM.The temperature field and stress field during the wrapping process of engineering ceramics were simulated by FEM.The mechanism of circumferential wrapping to reduce the edge chipping during engineering ceramics machined by MDSAM was revealed.

关 键 词：工程陶瓷 引弧微爆炸加工 边缘碎裂 周向包封 

分 类 号：TG391.7[金属学及工艺—金属压力加工] TQ174.75[化学工程—陶瓷工业]