浅谈印制板压合凹点凹陷的分析改善与研究  

Discussion on the analysis and improvement of the indentation of the pressed concave point of printed circuit board

作　　者：鲁永兴 Lu Yongxing

机构地区：[1]惠州市骏亚精密电路有限公司,广东惠州516083

出　　处：《印制电路资讯》2024年第1期104-107,共4页Printed Circuit Board Information

摘　　要：随着电子产品的精密化、小型化,压合层数越来越高,板面线路越来越密集,报废率越来越高。本文主要从凹点凹陷的产生机理,以及通过现象PP粉纤维丝凹点凹陷,铜粉凹点凹陷,异物类凹点凹陷,流胶屑凹点凹陷,牛皮纸屑凹点凹陷,铁屑、油污异物凹点凹陷,不明异物等各个方面来研究探讨凹点凹陷是如何产生的,具体有什么表现,可以制定什么方法来改善,进而提高品质,减少不良报废。With the precision and miniaturization of electronic products,the number of laminated layers is getting higher and hi gher,the board line is getting denser and denser,and the scrap rate is getting higher and higher.This paper mainly studies a nd discusses how pits occur and what their specific manifestations are from the production mechanism of pits,as well as fro m the phenomena of PP powder fiber pits,copper powder pits,foreign body pits,rubber dust pits,kraft paper dust pits,iron fi lings,oil oil foreign body pits,unidentified foreign body pits,etc.What methods can be developed to improve,thereby improv ing quality and reducing bad scrap.

关 键 词：残胶 介质层 凹陷 纤维丝 

分 类 号：P61[天文地球—矿床学]