Cu_(6)Sn_(5)纳米颗粒对SAC3005/Cu焊点形貌和性能的影响  

Effect of Cu_(6)Sn_(5)nanoparticles on the morphology and properties of SAC3005/Cu solder joints

作　　者：王彪[1] 赵建华[1] 刘一澎 杨杰[1] 严继康 WANG Biao;ZHAO Jianhua;LIU Yipeng;YANG Jie;YAN Jikang(School of New Energy and Materials,Southwest Petroleum University,Chengdu 610500,China)

机构地区：[1]西南石油大学新能源与材料学院,四川成都610500

出　　处：《电子元件与材料》2024年第1期121-126,共6页Electronic Components And Materials

基　　金：云南省创新团队(202105AE160028);云南省科学技术厅云南锡业集团(控股)有限责任公司基础研究应用基础研究企业联合专项(202101BC070001-010)。

摘　　要：研究了添加Cu_(6)Sn_(5)纳米颗粒对SAC3005焊料焊点金属间化合物的形貌和性能的影响。采用湿化学法制备Cu_(6)Sn_(5)纳米颗粒,将Cu_(6)Sn_(5)纳米颗粒添加到SAC3005焊料中,经回流焊后,制备SAC3005-xCu_(6)Sn_(5)(x=0%,0.12%,0.18%,质量分数)复合焊点。采用金相显微镜对焊点的横断面进行观察,对焊点的横断面金属间化合物(IMCs)进行测量。采用ANSYS有限元软件对界面IMCs模型进行模拟,分析印刷电路板(PCB板)焊点失效机理。结果表明:添加Cu_(6)Sn_(5)纳米颗粒改性SAC3005/Cu焊点后的IMCs层厚度变薄。Cu_(6)Sn_(5)纳米颗粒的加入抑制了回流焊接过程中IMCs的生长,提高了焊点的可靠性。Cu_(6)Sn_(5)纳米颗粒的添加阻碍了Sn原子和Cu原子在界面处的扩散,抑制了Cu_(6)Sn_(5)IMCs的生长。添加质量分数为0.12%的Cu_(6)Sn_(5)纳米颗粒时抑制效果最好。焊点界面Cu_(6)Sn_(5)层和Cu_(3)Sn层是应力应变集中的地方,焊点交界处为焊点服役过程中的薄弱环节。This work aims to investigate the impact of Cu_(6)Sn_(5)nanoparticles on the morphology and properties of intermetallic compounds(IMCs)in SAC3005 solder joints.Cu_(6)Sn_(5)nanoparticles were synthesized using a wet chemical method and then added into the SAC3005 solder.The resulting composite solder joints,named as SAC3005-xCu_(6)Sn_(5)(x=0%,0.12%,0.18%for mass fraction),were prepared through a reflow soldering process.Metallographic microscopy was used to characterize the cross-sections of the solder joints and detect the present of IMCs.Additionally,ANSYS finite element software was utilized to simulate the interface of IMCs and analyze the failure mechanism of solder joints on printed circuit board(PCB).The results indicate that the Cu_(6)Sn_(5)nanoparticles in SAC3005/Cu solder joints leads to thinner intermetallic compound(IMCs)layers by comparing with the ones without nanoparticles.The presence of Cu_(6)Sn_(5)nanoparticles inhibits the growth of IMCs during the reflow soldering process,thereby,to improve the reliability of the solder joints.Nanoparticles hinder the diffusion of Sn and Cu atoms at the interface,which prevent the growth of Cu_(6)Sn_(5)IMCs.The optimal suppression was achieved at the addition of 0.12%mass fraction of Cu_(6)Sn_(5)nanoparticles.The Cu_(6)Sn_(5)and Cu_(3)Sn layers experience stress and strain concentration at the solder joint interface,which is a weak point during the solder joint service life.

关 键 词：Cu_(6)Sn_(5)纳米颗粒 SAC3005焊料 金属间化合物 可靠性 

分 类 号：TN406[电子电信—微电子学与固体电子学]