基于芯片剥离参数分析的蓝膜固定直径可调式顶针罩设计与分析  

Design and analysis of needle cover with blue film fixed diameter adjustable based on analysis on chip stripping parameters

作　　者：王战中 李旭龙 黄帅可 方江河 卢鑫海 WANG Zhanzhong;LI Xulong;HUANG Shuaike;FANG Jianghe;LU Xinhai(College of Mechanical Engineering,Shijiazhuang TieDao University,Shijiazhuang 050043)

机构地区：[1]石家庄铁道大学机械工程学院,河北石家庄050043

出　　处：《机械设计》2024年第1期86-93,共8页Journal of Machine Design

摘　　要：针对现有芯片剥离工艺参数理论分析只进行单独参数分析并不考虑参数之间相互影响的问题,文中采用田口方法对在芯片剥离过程中的蓝膜固定直径和蓝膜底部真空吸附力这两个工艺参数进行了主次效应分析和交互作用分析,得出了蓝膜固定直径是影响芯片剥离的主要影响因素而蓝膜底部吸附力是次要影响因素的结论;进而基于该结论,设计了一种可调节蓝膜固定直径的顶针罩装置,并采用了ANSYS软件的流体模块分析和验证了这种可调节蓝膜固定直径顶针罩装置的可行性,为提高芯片剥离效率和增加芯片良品率提供新的思路。In view of the problem that the theoretical analysis of the existing chip stripping process parameters is only a separate parameter analysis without considering the interaction between the parameters,in this paper,the Taguchi method is used to analyze the primary and secondary effects and interaction of the two process parameters:the fixed diameter of the blue film and the vacuum adsorption force at the bottom of the blue film during the chip stripping process.It is concluded that the fixed diameter of the blue film is the main factor affecting the chip stripping,while the adsorption force at the bottom of the blue film is the secondary factor.Based on this conclusion,a thimble cover device with adjustable blue film fixed diameter is designed,and the feasibility of the adjustable blue film fixed diameter thimble cover device is analyzed and verified by using the fluid module of ANSYS software,which provides a new idea for improving chip stripping efficiency and chip quality.

关 键 词：芯片拾取 田口方法 顶针罩设计 流体力学仿真 

分 类 号：TH112.5[机械工程—机械设计及理论]