杂萘联苯双马来酰亚胺封装基板材料的制备与性能  

Preparation and Performance of Naphthalene Biphenyl Bismaleimide Substrate for Packaging

作　　者：牛慧敏 李战胜[1] 宗立率[1] Huimin Niu;Zhansheng Li;Lishuai Zong(Department of Polymer,School of Chemical Engineering,Dalian University of Technology,Dalian 116024,China)

机构地区：[1]大连理工大学化工学院高分子材料系,辽宁大连116024

出　　处：《高分子材料科学与工程》2024年第1期112-122,共11页Polymer Materials Science & Engineering

基　　金：国家自然科学基金-面上基金资助项目(52273065);国家自然科学基金-青年基金资助项目(51903028)。

摘　　要：针对高精密度电子芯片对封装基板材料耐热性不断提出新的要求,合成了一种杂萘联苯双马来酰亚胺(DHPZBMI)和新型固化剂二烯丙基联苯二酚(DABP)来制备高耐热性封装基板材料。通过熔融共混的方式,使用DHPZBMI、DABP与苯并噁嗪(BOZ)改性商用N,N’-(4,4’-二苯基甲烷)双马来酰亚胺(BDM)树脂,并采用与玻璃纤维布热压的方式制备出复合材料。通过差示扫描量热分析和红外光谱研究了树脂体系的固化过程,同时,进行了流变性能、热性能、力学性能等测试。研究结果表明,体系有宽温域(>100℃)加工窗口,5%热失重温度(T5%)高于395℃,有良好的热稳定性。DHPZBMI的加入有效提高了树脂体系的耐热性,25%的DHPZBMI摩尔添加量使得树脂体系的玻璃化转变温度(Tg)提高了20℃,且随DHPZBMI的增加而升高,最高达288℃。复合材料的Tg也呈现出相同的趋势,BDDB/GF-1的Tg高达314℃。其复合材料弯曲强度最高为821 MPa,弯曲模量达41.2 GPa,介电损耗低至0.011,热膨胀系数低于45×10-6K-1,与铜箔的剥离强度达1.025 N/mm。整个体系具有良好的综合性能,在封装基板领域具有广阔的应用前景。In response to the new requirements for heat resistance of packaging substrate materials for high precision electronic chips,a heteronaphthalene biphenyl bismaleimide(DHPZBMI)and a new curing agent diallyl biphenol(DABP)were synthesized in order to prepare highly heat resistant packaging substrate materials.The composites were prepared by melt blending using DHPZBMI,DABP with benzoxazine(BOZ)modified commercial N,N'-(4,4'-diphenylmethane)bismaleimide(BDM)resin and hot pressing with glass fiber cloth.The curing process of the resin system was studied by DSC and FT-IR,while the rheological properties,thermal and mechanical properties were characterized.The results show that the system has a wide temperature range(>100℃)processing window,the initial decomposition temperature T5%is higher than 395℃,and a good thermal stability.The Tg of the composite also shows the same trend,and the Tg of BDDB/GF-1 is up to 314℃.The bending strength of the composite is up to 821 MPa,and the bending modulus is up to 41.2 GPa;the dielectric loss is as low as 0.011;the coefficient of thermal expansion is less than 45×10-6K-1;the peel strength with copper foil is up to 1.025 N/mm.The system has good comprehensive performance and a broad application prospect in the field of packaging substrates.

关 键 词：双马来酰亚胺 烯丙基化合物 苯并噁嗪 共混改性 封装基板 

分 类 号：TN604[电子电信—电路与系统]