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作 者:阳建君 陈罗威 范才河[1] 吴琴 欧玲[1] 王襁平 YANG Jianjun;CHEN Luowei;FAN Caihe;WU Qin;OU Ling;WANG Qiangping(College of Materials and Advanced Manufacturing,Hunan University of Technology,Zhuzhou Hunan 412007,China;National Key Laboratory for Remanufacturing,Academy of PLAArmored Forces Engineering,Beijing 100072,China;Technology Center,Hunan Minrui Science and Technology Co.,Ltd.,Xiangtan Hunan 411228,China)
机构地区:[1]湖南工业大学材料与先进制造学院,湖南株洲412007 [2]中国人民解放军陆军装甲兵学院装备再制造技术国防科技重点实验室,北京100072 [3]湖南敏锐科技有限公司技术中心,湖南湘潭411228
出 处:《包装学报》2024年第1期34-47,共14页Packaging Journal
基 金:国家自然科学基金资助项目(52271177);湖南省科技创新领军人才基金资助项目(2021RC4036);湖南省自然科学基金资助项目(2022JJ50080);国防科技重点实验室基金资助项目(6142005200305)。
摘 要:分别采用恒定电压和阶梯电压在纯铝板表面制备陶瓷膜层,研究不同电压模式对陶瓷膜层组织和性能的影响。借助扫描电子显微镜、X射线衍射仪、显微硬度计和电化学工作站等,研究纯铝板表面陶瓷膜层的微观形貌、物相、显微硬度和耐腐蚀性能,并分析陶瓷膜层形成机理。结果表明:纯铝板表面陶瓷膜层是非晶态Al2O3相,与恒定电压相比,采用阶梯电压制备的陶瓷膜层孔洞、裂纹等缺陷较少。恒定电压和阶梯电压为26 V时,陶瓷膜层显微硬度均达到最大,分别为520.2 HV和570.2 HV。阶梯电压为26 V时,陶瓷膜层耐腐蚀性能最佳,自腐蚀电位和极化电阻分别为-0.429 V和113173.9Ω。采用阶梯电压在纯铝板表面制备陶瓷膜层时,每次电压升高都会加速化学反应速率,在纯铝板表面生成致密均匀的内部阻挡层,从而提高陶瓷膜层的显微硬度和耐腐蚀性能。Ceramicfilms were prepared on pure aluminum plates using both constant and step voltages to study the effects of different voltage modes on the microstructure and properties of the ceramicfilm layers.Utilizing scanning electron microscopy,X-ray diffraction,microhardness testers,and electrochemical workstations,the micro-morphology,phase composition,microhardness,and corrosion resistance of the ceramicfilm layers on pure aluminum plates were examined,while the formation mechanism of these layers was analyzed.The results showed that the ceramicfilm layers on the pure aluminum plates were amorphous Al2O3 phases.Compared to constant voltage,the step voltage method resulted in fewer pores,cracks,and other defects in the ceramicfilms.The microhardness of the ceramicfilm layers reached its maximum at 26 V for both constant and step voltages,registering 520.2 HV and 570.2 HV,respectively.At a step voltage of 26 V,the ceramicfilm exhibited optimal corrosion resistance,with a corrosion potential of-0.429 V and a polarization resistance of 113173.9Ω.When applying step voltage to prepare the ceramicfilm layers on pure aluminum plates,each voltage increase accelerated the chemical reaction rate,resulting in a dense and uniform internal barrier layer on the surface,thereby enhancing the microhardness and corrosion resistance of the ceramicfilm layers.
关 键 词:纯铝板 陶瓷膜层 阶梯电压 显微组织 耐腐蚀性能
分 类 号:TG174.4[金属学及工艺—金属表面处理]
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