有限空间内电子芯片风冷系统的优化研究  

Optimisation of Air-cooling System for Electronic Chips in Limited Space

作　　者：郭小轩 杨斌[2] 李炳熙[1] 王维[1] GUO Xiao-xuan;YANG Bin;LI Bing-xi;WANG Wei(School of Energy Science and Technology,Harbin Institute of Technology,Harbin 150001,China;Beijing Institute of Precision Electromechanical Control Equipment,Beijing 10071,China)

机构地区：[1]哈尔滨工业大学能源科学与工程学院,黑龙江哈尔滨150001 [2]北京精密机电控制设备研究所,北京100071

出　　处：《节能技术》2024年第1期21-26,共6页Energy Conservation Technology

基　　金：国家自然科学基金青年科学基金项目(52106082);中国博士后科学基金特别资助(2022T150160);中国广核集团-哈尔滨工业大学先进核能与新能源研究院(CGN-HIT202308);黑龙江省自然科学基金联合引导项目(LH2022E064)。

摘　　要：芯片的冷却问题已经成为限制电子设备发展的技术瓶颈之一。本文通过数值模拟,对某人脸识别电子芯片在有限空间内的散热问题展开优化研究。研究芯片温升与轴流风扇流量、进风面积、芯片工作功率的关系,并通过多目标优化得到更加符合当前目标需求的芯片及风扇的工作参数。研究结果表明,轴流风扇流量从0增加到9CFM范围内,芯片温升下降约56%;风扇进风面积从0.031 m^(2)增大到0.196 m^(2),芯片温升上升13%;随着芯片功率增加,芯片稳定工作的温升呈线性提升。通过多目标优化设计,得到的芯片及风扇的工作参数为P=5.87 W,Q=1.056 CFM,A=0.041 m^(2)。The cooling problem of chips has become one of the technical bottlenecks limiting the development of electronic devices.In this paper,through numerical simulation,the heat dissipation problem of a face recognition electronic chip in a limited space is studied.The relationship between the chip temperature rise and the axial fan flow rate,air inlet area,and chip operating power is studied,and the operating parameters of the chip and the fan are obtained through multi-objective optimisation to better meet the current target requirements.The results show that the temperature rise of the chip decreases by about 56%when the axial fan flow increases from 0 to 9 CFM;the temperature rise of the chip increases by 13%when the fan inlet area increases from 0.031 m^(2) to 0.196 m^(2);and the temperature rise of the stable operation of the chip increases linearly with the increase of the chip power.Through the multi-objective optimisation design,the operating parameters of the chip and fan obtained are P=5.87 W,Q=1.056 CFM,A=0.041 m^(2).

关 键 词：电子芯片 风冷系统 数值模拟 轴流风扇 多目标优化 

分 类 号：TH49[机械工程—机械制造及自动化]