A Novel Multiple DBC-staked units Package to Parallel More Chips for SiC Power Module  

作　　者：Xiaoshuang Hui Puqi Ning Tao Fan Yuhui Kang Kai Wang Yunhui Mei Guangyin Lei 

机构地区：[1]Institute of Electrical Engineering Chinese Academy of Sciences,Beijing 100049,China [2]the school of Electronic,Electrical and Communication Engineering,University of Chinese Academy of Sciences,Beijing 100190,China [3]IEEE [4]the School of Electrical Engineering,Tiangong University,Tianjin 300387,China [5]the Academy for Engineering and Technology,Fudan University,Shanghai 200433,China

出　　处：《CES Transactions on Electrical Machines and Systems》2024年第1期72-79,共8页中国电工技术学会电机与系统学报（英文）

基　　金：supported in part by National Key R&D Program of China (2021YFB2500600);CAS Youth multi-discipline project (JCTD-2021-09);Strategic Piority Research Program of Chinese Academy of Sciences (XDA28040100)。

摘　　要：Silicon carbide(SiC) power modules play an essential role in the electric vehicle drive system. To improve their performance, reduce their size, and increase production efficiency, this paper proposes a multiple staked direct bonded copper(DBC) unit based power module packaging method to parallel more chips. This method utilizes mutual inductance cancellation effect to reduce parasitic inductance. Because the conduction area in the new package is doubled, the overall area of power module can be reduced. Entire power module is divided into smaller units to enhance manufacture yield, and improve design freedom. This paper provides a detailed design, analysis and fabrication procedure for the proposed package structure. Additionally, this paper offers several feasible solutions for the connection between power terminals and DBC untis. With the structure, 18dies were paralleled for each phase-leg in a econodual size power module. Both simulation and double pulse test results demonstrate that, compared to conventional layouts, the proposed package method has 74.8% smaller parasitic inductance and 34.9% lower footprint.

关 键 词：Silicon carbide Electric vehicle Power modules PACKAGE 

分 类 号：TN405[电子电信—微电子学与固体电子学]