基片等离子处理对PTFE微波基板性能的影响  

Effect of Substrate Plasma Treatment on the Performance of PTFE Microwave Substrate

作　　者：金霞 韩笑 薛微婷 冯春明 冯贝贝 JIN Xia;HAN Xiao;XUE Weiting;FENG Chunming;FENG Beibei(The 46th Research Institute of China Electronics Technology Group Corporation,Tianjin 300220,China)

机构地区：[1]中国电子科技集团公司第四十六研究所,天津300220

出　　处：《塑料工业》2024年第2期54-59,78,共7页China Plastics Industry

摘　　要：采用等离子处理对聚四氟乙烯(PTFE)基片进行表面处理,研究气体流量、放电功率、处理时间的变化对PTFE基片微观形貌和接触角的影响,进而研究对PTFE微波基板介质损耗、吸水率、剥离强度等综合性能的影响。实验结果表明,等离子体处理可以有效增加基片表面粗糙度,降低PTFE基片的接触角,提高其表面能,使覆铜箔层压板的铜箔与介质层之间结合强度提升,制备的PTFE微波基板的剥离强度可接近未处理之前剥离强度的3倍。The surface treatment of polytetrafluoroethylene(PTFE)substrate was carried out by plasma treatment.The effects of gas flow rate,discharge power and treatment time on the microstructure and contact angle of PTFE substrate were studied,and then the effects on the dielectric loss,water absorption and peel strength of PTFE microwave substrate were studied.The experimental results show that plasma treatment can effectively increase the surface roughness of the substrate,reduce the contact angle of the PTFE substrate,improve its surface energy and the bonding strength between the copper foil and the dielectric layer.The peeling strength of the prepared PTFE microwave substrate can be nearly three times that of the untreated PTFE substrate.

关 键 词：等离子 聚四氟乙烯 微波基板 接触角 介质损耗 吸水率 剥离强度 

分 类 号：TQ323[化学工程—合成树脂塑料工业]