芯片封装基板微孔高速钻削试验研究  

Experimental Investigation on High-speed Drilling of Micro-holes in IC Packaging Substrates

作　　者：欧远辉 张辉 金哲峰 梅健 OU Yuanhui;ZHANG Hui;JIN Zhefeng;MEI Jian(Shenzhen Jinzhou Precision Technology Co.,Ltd.,Shenzhen 518116,Guangdong,China)

机构地区：[1]深圳市金洲精工科技股份有限公司,广东深圳518116

出　　处：《中国钨业》2023年第6期69-79,共11页China Tungsten Industry

基　　金：国家重点研发计划课题(2022YFB3806703);中国五矿集团科技专项(2022ZXA03)。

摘　　要：研究了典型的16种封装基板的机械钻孔加工性能。通过对孔位精度、孔壁粗糙度、毛刺高度、缠丝和磨损等指标的测试,利用主成分分析法,获得了封装基板的组成与理化特性对钻孔加工性能的影响,并对封装基板的机械钻孔加工性能进行综合评价。结果表明,在相同的条件下,封装基板的玻璃纤维分布稀疏,硬质填料含量低时,微钻磨损量减小,孔位精度提高,孔壁粗糙度和毛刺改善,圆周方向的缠丝得到有效抑制,封装基板的钻孔加工性能得到优化。在固定叠板厚度的条件下,铜箔从基体材料上剥离强度对孔口毛刺和缠丝有显著影响,剥离强度大,毛刺和缠丝现象减轻,封装基板的钻孔性能得到提升。封装基板可按加工难易程度分类,针对难加工封装基板,涂层可以显著减轻微钻的缠丝与降低微钻的磨损,提升钻孔性能与微钻使用寿命。The mechanical drilling performance of 16 typical packaging substrates was studied.The effects of package composition,physical and chemical characteristics substrate on the drilling performance is obtained.The hole position accuracy,hole wall roughness,burr height,wire winding and wear are discussed by using the principal component analysis method.The mechanical drilling performance of the package substrate is comprehensively evaluated.The results show that:under the conditions of sparse glass fiber distribution of encapsulated substrate and low content of hard filler,the microdrill wear is reduced with the improved hole position accuracy.With the improving hole wall roughness and suppression of the tangling in the circumferential direction,the drilling performance of the encapsulated substrate is optimized.Under the condition of fixed stacked plate thickness,the peeling strength of copper foil from the substrate material has a significant effect on the hole burr and tangle.With a large peeling strength,the burr and tangle phenomenon is reduced,and the drilling performance of the package substrate is improved.Packaging substrates can be categorized according to the degree of processing difficulty.For difficult-processed packaging substrates,the coating can significantly reduce the micro-drill tangle and reduce the wear of the micro-drill.The drilling performance and service life of the micro-drill has been greatly improved.

关 键 词：封装基板 微型钻头 微孔钻削 主成分分析 涂层 磨损 

分 类 号：TN41[电子电信—微电子学与固体电子学]