单柱微通道流动沸腾换热数值模拟研究  

Numerical Simulation of Flow Boiling Heat Transfer in Microchannel With a Single Microcolumn

作　　者：袁义 李晓宇 张雨 陈黎 陶文铨 YUAN Yi;LI Xiaoyu;ZHANG Yu;CHEN Li;TAO Wenquan(Key Laboratory of Thermo-Fluid Science and Engineering of MOE,School of Energy and Power Engineering,Xi’an Jiaotong University,Xi’an,Shaanxi 710049,China;Qingdao Hisense Hitachi Air-conditioning Systems Co.,Ltd.,Qingdao 266510,China)

机构地区：[1]西安交通大学能源与动力工程学院,热流科学与工程教育部重点实验室,西安710049 [2]青岛海信日立空调系统有限公司,青岛266510

出　　处：《工程热物理学报》2024年第3期819-825,共7页Journal of Engineering Thermophysics

基　　金：国家重点研发计划(No.2021YFB4001701)。

摘　　要：高功率电子芯片的安全运行需要高效的散热技术。流动沸腾换热由于高换热系数受到广泛关注。为精确模拟微通道内流动沸腾复杂两相流过程,本文提出了耦合VOF方法的在相界面处迭代求解能量源项的相变模型。针对单微柱微通道内流动沸腾换热过程进行了数值模拟,分析了瞬态两相流过程及温度场演变规律,查明了热流密度及进口过冷度的影响机制。结果表明,由于局部蒸汽的覆盖,不同工况下微通道内流动沸腾存在热阻的转折点,高热流密度对应更高的气泡生长速度和成核面积,高过冷度会延缓转折点,但整体热阻将升高。The safe operation of high-power electronic chips highly requires high-efficiency heat dissipation techniques.Flow boiling heat transfer has received widespread attention due to the high heat transfer coefficient.To accurately simulate the complex two-phase process of flow boiling in a microchannel,a phase change model based on the volume of fluid(VOF)method with phase interface temperature correction is proposed in this paper.The flow boiling heat transfer process in a single microchannel with a single microcolumn is simulated to investigate the effects of heat flux and inlet subcooling by analyzing the evolution of two-phase flow process and temperature field.The results show that due to the local vapor coverage,there is a turning point of thermal resistance for flow boiling in microchannel under different working conditions,and high heat flux corresponds to higher bubble growth rate and nucleation area.A high subcooling will delay the turning point,but the overall thermal resistance will increase.

关 键 词：流动沸腾换热 微通道 VOF方法 数值模拟 

分 类 号：TK121[动力工程及工程热物理—工程热物理]