共聚型耐高温热固性聚酰亚胺树脂的制备与性能研究  

Preparation and Properties of Copolymerized Thermosetting Polyimide Resins with High Temperature Resistance

作　　者：宇平 彭万 张乐乐 黄琦睿 吴述培 贾子辰 曲延培 王海跃 潘丽静 胡一鸣 YU Ping;PENG Wan;ZHANG Lele;HUANG Qirui;WU Shupei;JIA Zichen;QU Yanpei;WANG Haiyue;PAN Lijing;HU Yiming(School of Environmental and Chemical Engineering,Jiangsu Ocean University,Lianyungang 222005,China;Jiangsu Key Laboratory of Function Control Technology for Advanced Materials,Jiangsu Ocean University,Lianyungang 222005,China;Changzhou JME Advanced Materials Co.,Ltd.,Changzhou 213200,China)

机构地区：[1]江苏海洋大学环境与化学工程学院,江苏连云港222005 [2]江苏海洋大学江苏省先进材料功能调控技术重点实验室,江苏连云港222005 [3]常州杰铭新材料科技有限公司,江苏常州213200

出　　处：《江苏海洋大学学报（自然科学版）》2024年第1期38-43,共6页Journal of Jiangsu Ocean University:Natural Science Edition

基　　金：江苏省高校大学生创新创业训练计划项目(202311641176H,202211641178T,202311641099Y);产学研合作项目(HKK2022038);常州市第十二批科技计划项目(产业前瞻与关键核心技术)(CE20230002)。

摘　　要：航空航天、国防军工、电子设备等领域对材料的耐温等级提出了越来越高的要求。为进一步改善热固性聚酰亚胺材料的耐温性能,以3,4′-二氨基二苯醚(3,4′-ODA)为二胺,4-苯乙炔基苯酐(4-PEPA)为封端剂,利用异构的2,3,3′,4′-联苯四甲酸二酐(a-BPDA)和2,3,3′,4′-二苯醚四甲酸二酐(a-ODPA)进行共聚改性制备一类热固性聚酰亚胺材料。利用红外光谱、X射线衍射、差示扫描量热分别表征了其化学结构、聚集态结构及热性能。结果表明,实验获得了聚合度为6的聚酰亚胺预聚体,其结构主要是非晶态结构,易溶解于有机溶剂。同时,预聚体材料玻璃化转变温度为196~209℃,固化后树脂的玻璃化转变温度由273℃提高到305℃,提高了32℃。该类共聚型热固性聚酰亚胺在高温部件和复杂结构件中具有潜在应用价值。The demand for materials with higher temperature resistance is increasing in the fields of aerospace,national defense,electronic devices and other industries.In order to further enhance the temperature resistance of thermosetting polyimide materials,3,4′-oxydianiline(3,4′-ODA)was used as diamine,and 4-phenylethynylphthalic anhydride(4-PEPA)was used as the reactive end cap.A series of thermosetting polyimide materials with copolymerization were prepared by modifying asymmetrical 2,3,3′,4′-diphenyl tetracarboxylic anhydride(a-BPDA)and 2,3,3′,4′-diphenyl ether tetracarboxylic acid dianhydride(a-ODPA).The chemical structure,aggregation state structure and thermal properties were characterized by infrared spectroscopy,X-ray diffraction and differential scanning calorimetry,respectively.The results indicate that the polyimide oligomers with a degree of polymerization of 6 have been successfully synthesized.The structure is amorphous,making it easily dissolved in organic solvents.At the same time,the glass transition temperature of the oligomers is 196—209℃,and the glass transition temperature of the cured resin is increased by 32℃from 273℃to 305℃.The paper provides a reference for the design and development of high-temperature-resistant polyimide resins.

关 键 词：热固性聚酰亚胺 共聚 不对称 耐高温 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]