TiB2涂层熔盐电沉积制备与表征  

Preparation and Characterization of TiB2 Coating by Molten Salt Electrodeposition

作　　者：郭不拘 薛正铎 张元坤 牛子儒 刘爱民[1] 李松 雷以柱 石忠宁 Guo Buju;Xue Zhengduo;Zhang Yuankun;Niu Ziru;Liu Aimin;Li Song;Lei Yizhu;Shi Zhongning(Key Laboratory for Ecological Metallurgy of Multimetallic Mineral(Ministry of Education),Northeastern University,Shenyang 110819,China;Stay Key Laboratory of Rolling and Automation,Northeastern University,Shenyang 110819,China;School of Chemical and Materials Engineering,Liupanshui Normal University,Liupanshui 553000,China)

机构地区：[1]东北大学多金属共生矿生态化冶金教育部重点实验室,辽宁沈阳110819 [2]东北大学轧制技术及连轧自动化国家重点实验室,辽宁沈阳110819 [3]六盘水师范学院化学与材料工程学院,贵州六盘水553000

出　　处：《稀有金属材料与工程》2024年第2期449-456,共8页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(52074084)。

摘　　要：炭阴极在铝电解槽中受熔盐和铝液腐蚀而影响寿命,而TiB2涂层是铝电解槽理想的阴极材料。本实验以石墨为基体,在KF-KCl-K2TiF6-KBF4熔盐中以电流密度0.4~0.7 A·cm^(-2)、温度700~800℃电沉积TiB2涂层,通过XRD衍射仪、SEM-EDS、表面粗糙度测量仪及附着力测试仪对不同电流密度和温度下制备的涂层进行表征。结果表明:在石墨基体上可以得到均匀连贯的TiB2涂层;增大电流密度、降低电解温度可以细化涂层晶粒,提高涂层致密性;在0.6 A·cm^(-2)、750℃最优电沉积条件下制得的TiB2涂层的厚度为239μm,择优取向为<110>,表面粗糙度为14.85μm,涂层与石墨基体的结合力为6.39 MPa。The lifespan of carbon cathode is affected by the corrosion of molten salt and molten aluminum in aluminum reduction cell,and TiB2 coating is an ideal cathode material for aluminum reduction cells.In this study,TiB2 coatings were electrodeposited on graphite in KF-KCl-K2TiF6-KBF4 molten salt at 700–800℃with the current density of 0.4–0.7A·cm^(-2).The coatings prepared at different current densities and temperatures were analyzed by XRD,SEM-EDS,surface roughness tester and adhesion tester.The results show that the obtained TiB2 coating is uniform and coherent well to the graphite substrate.Increasing the current density and the electrolysis temperature can refine the grain size of the coating and improve the compactness of the coating.A TiB2 coating with 239μm in thickness preferred orientation of<110>,and surface roughness of 14.85μm is achieved,and the adhesion under the optimum condition of 0.6 A·cm^(-2) and 750℃between the coating and graphite substrate is 6.39 MPa.

关 键 词：熔盐 电沉积 TIB2 涂层 

分 类 号：TG174.4[金属学及工艺—金属表面处理]