缓冲材料对多层印制电路板压合的影响研究  

Research on the influence of cushioning materials on multilayer PCB pressing

作　　者：吴科建 韩雪川 陈文卓 曹宏伟 吴杰 WU Kejian;HAN Xuechuan;CHEN Wenzhuo;CAO Hongwei;WU Jie(Shennan Circuits Co.,Ltd.,Shenzhen 518117,Guangdong,China)

机构地区：[1]深南电路股份有限公司,广东深圳518117

出　　处：《印制电路信息》2024年第3期16-20,共5页Printed Circuit Information

摘　　要：压合是印制电路板(PCB)生产过程中的重要制程之一。测试了不同缓冲材料的缓冲性能,并对比研究了不同缓冲材料的叠板结构对板厚均匀性、涨缩比例、可靠性、填胶的影响。研究结果表明,PacoPads缓冲材料压合叠板,在板厚均匀性、涨缩比例方面表现最好,3 mm高多层PCB的板厚极差在0.2 mm以内,涨缩变化在0.04 mm内;铝片+三合一缓冲材料压合叠板,在填胶方面表现最好,可实现0.8mm节距的球栅阵列(BGA)和50mm×50mm无铜区的有效填胶。研究结果可为解决高多层PCB的板厚均匀性、缺胶等问题提供参考和借鉴。Pressing is one of the important processes in the production of printed circuit board(PCB).This article tests the cushioning properties of different cushioning materials,and comparatively analyzes the effects of different stacking structures on board thickness,uniformity expansion/contraction ratio,reliability,and resin filling.Research results show that the PacoPads cushioning material laminate performs uniformity the best in terms of board thickness uniformity and expansion/contraction ratio,for a high multi-layer PCB with board thickness of 3 mm,the board thickness range can be within 0.2 mm,and the expansion/contraction can be within 0.04 mm;the aluminum sheet+three-in-one cushioning material laminated performs the best in terms of resin filling,and can achieve effective filling of 0.8 mm pitch ball grid array(BGA)and 50 mm×50 mm copper-free area.This article can provide reference for solving problems such as board thickness uniformity and resin-starving in high multi-layer PCB.

关 键 词：印制电路板 压合缓冲 叠板结构 板厚均匀性 缺胶 

分 类 号：TN41[电子电信—微电子学与固体电子学]