FPC板电镀镍金焊盘掉件失效原因分析  

Failure Analysis of Components Dropping from Electroplating Ni/Au Pads on FPC Board

作　　者：汪洋[1] 李晓倩[1] 张宣 王有成 WANG Yang;LI Xiaoqian;ZHANG Xuan;WANG Youcheng(CEPREI-EAST,Suzhou 215011,China)

机构地区：[1]工业和信息化部电子第五研究所华东分所,江苏苏州215011

出　　处：《电子产品可靠性与环境试验》2024年第1期91-95,共5页Electronic Product Reliability and Environmental Testing

摘　　要：柔性电路板(FPC)广泛地应用于各种电子产品中,随着电子产品的小型化,表面贴装技术(SMT)普遍地应用于电路装连,以实现元器件间的电气导通和信号传输。现介绍一种电镀镍金FPC板在SMT后出现掉件的失效概况,通过体视显微镜、剪切力测试、扫描电子显微镜(SEM)、能谱仪(EDS)和X射线荧光测厚仪(XRF)等测试方法和表征手段,对失效样品进行了系统分析,发现掉件是因为焊盘镀镍层和底铜层之间结合不良、存在明显缝隙所致,而结合力差主要与电镀过程控制不当有关,如电镀前清洗不彻底等。Flexible printed circuit(FPC)is widely used in various electronic products.With the miniaturization of electronic products,SMT is generally used in circuit assembly to realize electrical conduction and signal transmission between components.The failure of components dropping from electroplated Ni/Au pads on FCP board after SMT process is introduced.The failed samples are systematically analyzed by stereo microscope,shear test,scanning electron microscope(SEM),energy dispersive spectrometer(EDS),X-ray fluorescence thickness gauge(XRF)and other methods.It is found that the components dropping are due to poor bonding between the nickel plating layer of the pad and the bottom copper layer,and there are obvious gaps.The poor bonding force is mainly related to improper control of the electroplating process,such as incomplete cleaning before electroplating.

关 键 词：失效分析 掉件 电镀Ni/Au 柔性电路板 

分 类 号：TQ153.2[化学工程—电化学工业]