二甲基对苯二甲基型氰酸酯的合成与性能研究  

Synthesis and performance study of dimethyl p-xylylene cyanate

作　　者：申栋梁 魏运召[1] 吴健伟[1] 付刚[1] 赵玉宇[1] 王冠[1] Shen Dongliang;Wei Yunzhao;Wu Jianwei;Fu Gang;Zhao Yuyu;Wang Guan(Institute of Petrochemistry,Heilongjiang Academy of Sciences,Harbin 150040,Heilongjiang,China)

机构地区：[1]黑龙江省科学院石油化学研究院,黑龙江哈尔滨150040

出　　处：《中国胶粘剂》2024年第3期31-37,44,共8页China Adhesives

摘　　要：以对苯二甲基二甲醚为原料合成了二甲基对苯二甲基型苯酚(DMPXPh)。采用氯化氰-酚方法制备出新型二甲基对苯二甲基型氰酸酯(DMPXCy),并测定了其结构。考察了材料的热性能、耐湿热性、介电性能和力学性能,并与双酚A型氰酸酯(BADCy)进行比较。研究结果表明:(1)红外和核磁氢谱表征证明已经成功地制备出目标酚中间体,并且酚中间体已被氰酸酯化制备成氰酸酯单体。(2)DMPXCy的固化行为和热性能研究表明,DMPXCy反应活性低于BADCy树脂,并且加入有机金属催化剂后,固化温度明显降低,可在280℃内阶梯固化。另外,DMPXCy树脂的玻璃化转变温度比BADCy树脂低,热稳定性基本相同,但DMPXCy的残炭率较高,显示出一定的耐烧蚀性。(3)力学性能研究表明,DMPXCy树脂总体力学强度与BADCy相近,拉伸强度略低。(4)DMPXCy树脂吸湿性和介电性能研究说明,DMPXCy树脂展现出优异的介电性能和低吸湿性,介电常数(ε)与介电损耗角正切(tanδ)分别为2.650和0.00450,饱和吸湿率为0.70%,远低于BADCy树脂的介电损耗和吸湿率。DMPXCy树脂作为低介电透波材料或高尺寸精度航天复合材料和胶粘剂的树脂基体,具有良好的应用潜力。Dimethyl p-xylylene phenol(DMPXPh)was synthesized by using p-phenyldimethyl ether as the raw material,and a new type of dimethyl p-xylylene cyanate(DMPXCy)was prepared by the cyanogen chloridephenol method,and the structure was measured.The thermal properties,moisture and heat resistance,dielectric properties,and mechanical properties of the material were investigated,and compared with bisphenol A cyanate(BADCy).The research results showed that,(1)The characterization by infrared and nuclear magnetic resonance spectroscopy confirmed that the target phenolic intermediate was successfully prepared,and the phenolic intermediate was synthesized into cyanate monomer through cyanate esterification.(2)The study on the curing behavior and thermal performance of DMPXCy showed that the reaction activity of DMPXCy was lower than that of BADCy resin,and the addition of organic metal catalysts significantly reduced the curing temperature,allowing for stepwise curing within 280℃.In addition,the glass transition temperature of DMPXCy resin was lower than that of BADCy resin,and its thermal stability was basically the same.However,the residual carbon rate of DMPXCy was higher,indicating a certain degree of ablation resistance.(3)The research on mechanical properties showed that the overall mechanical strength of DMPXCy resin was similar to that of BADCy,with slightly lower tensile strength.(4)The research on the moisture absorption and dielectric properties of DMPXCy resin showed that DMPXCy resin exhibited excellent dielectric properties and low moisture absorption,the dielectric constant(ε)and dielectric loss tangent(tanδ)were 2.650 and 0.00450,respectively,the saturation moisture absorption rate was 0.70%,which were much lower than the dielectric loss and moisture absorption rate of BADCy resin.DMPXCy resin had good application potential as a resin matrix for low dielectric transparent materials or high-precision aerospace composite materials and adhesive.

关 键 词：氰酸酯 二甲基对苯二甲基型 合成 介电性能 低吸湿性 

分 类 号：TQ437[化学工程]