Effects of Stereolithography Process Parameters on the Curing Properties of Si_(3)N_(4)Ceramic Slurries  

作　　者：Lina Zhan Yuzhibiao Xia Xuan Zhang Yao Liu Shaojun Liu 

机构地区：[1]College of Mechanical and Electronic Engineering,Pingxiang University,Pingxiang,337000,China [2]State Key Laboratory for Powder Metallurgy,Central South University,Changsha,410083,China [3]Shenzhen Research Institute,Central South University,Shenzhen,510085,China

出　　处：《Chinese Journal of Mechanical Engineering(Additive Manufacturing Frontiers)》2023年第4期65-71,共7页中国机械工程学报（增材制造前沿）（英文）

基　　金：supported by Natural Science Foundation of Jiangxi Province of China(Grant No.20212BAB204048);The Science and Technology Plan Projects of Jiangxi Provincial Department of Education of China(Grant Nos.GJJ.212714,GJJ.2202117).

摘　　要：This paper systematically investigates the effects of process parameters,such as exposure time and slice thickness,on the polymerization kinetics of a Si_(3)N_(4)ceramic slurry.The higher the C=C conversion rate in the SLA process,the faster the polymerization rate in the slurry during the initial exposure.However,when the UV exposure time is increased from 5 to 20 s,the solidified gel in the slurry hinders the diffusion of free radicals,causing the C=C conversion rate to stop.The slurry achieves a C=C conversion rate of up to 81%and a curing dimensional accuracy of up to IT7 level at an exposure time of 10 s.When the penetration depth of the slurry is equal to the slice thickness,the difference in C=C conversion rates between the ends of the blank is at least 21%.Furthermore,the Si3 N4 ceramics processed by stereolithography exhibit no defects,such as warpage or holes.

关 键 词：STEREOLITHOGRAPHY Si_(3)N_(4)slurry C=C conversion Curing accuracy 

分 类 号：TB32[一般工业技术—材料科学与工程]