挤压速度对搅拌摩擦反挤压法制备Cu-5%Ti_(2)SnC复合丝材性能的影响  

Effect of extrusion speed on properties of Cu−5vol.%Ti_(2)SnC composite wire fabricated by friction stir back extrusion process

作　　者：Amirhossein JAHANI Hamed JAMSHIDI AVAL Mohammad RAJABI Roohollah JAMAATI 

机构地区：[1]Department of Materials Engineering,Babol Noshirvani University of Technology,Shariati Avenue,Babol 47148-71167,Iran

出　　处：《Transactions of Nonferrous Metals Society of China》2024年第3期935-951,共17页中国有色金属学报（英文版）

摘　　要：对粉末冶金法制备的含5%(体积分数)Ti_(2)Sn CMAX相的初始复合材料进行搅拌摩擦反挤压(FSBE)处理,研究FSBE工艺的轴向横移速度对Cu-Ti_(2)Sn C复合线材显微组织、力学性能、电学性能和磨损性能的影响。结果表明,随着挤压速度的增加,显微组织中孪晶增多,Ti_(2)SnC颗粒细化,MAX相和Cu基体之间的界面结合改善。当转速为600r/min,轴向横移速度为25mm/min时,Cu-Ti_(2)SnC复合线材具有最大的硬度、屈服强度和极限抗拉强度,分别为HV 132.7、278.34MPa和485.15MPa,这是其更强的界面结合和更细的MAX相导致的。此外,当转速为600 r/min,轴向横移速度为25 mm/min时,Cu-Ti_(2)SnC复合丝的电导率最高,达到89.21%(IACS),磨损率最低,为0.0015 mg/m,这是其更大的晶粒尺寸、更强的界面结合与更低的密度导致的。The effect of axial traverse speed of friction stir back extrusion(FSBE)process on the microstructure,mechanical,electrical,and wear properties of Cu-Ti_(2)SnC composite wire was investigated.The FSBE process was performed on the primary composite made by the powder metallurgy method with 5 vol.%of Ti_(2)SnC MAX phase.The results showed that as the extrusion speed increased,the twins formed in the microstructure increased,the Ti_(2)SnC particles became finer,and the interface of bonding of the MAX phase-Cu matrix improved.The Cu-Ti_(2)SnC composite wire fabricated at the rotational speed of 600 r/min and axial traverse speed of 25 mm/min showed the maximum hardness,yield strength,and ultimate tensile strength of HV 132.7,278.34 MPa,and 485.15 MPa,respectively.This finding was due to its strong interfacial bonding and fine MAX phase particles.Besides,the larger grain size,the better interface bonding,and the lower the porosity resulted in the highest electrical conductivity of 89.21%(IACS)and least wear rate of 0.0015 mg/m of Cu-Ti_(2)SnC composite wire fabricated at rotational speed of 600 r/min and axial traverse speed of 25 mm/min.

关 键 词：搅拌摩擦反挤压 Ti_(2)SnC MAX相 铜基复合材料 电导率 

分 类 号：TB333[一般工业技术—材料科学与工程]