飞秒激光直写三维光波导的应用与挑战(特邀)  

Three-Dimensional Femtosecond-Laser Direct-Written Optical Waveguide:Advancements and Challenges(Invited)

作　　者：李泽政 郭帅鹏 蒋闯 柯少林 田振男 Li Zezheng;Guo Shuaipeng;Jiang Chuang;Ke Shaolin;Tian Zhennan(State Key Laboratory of Integrated Optoelectronics,College of Electronic Science and Engineering,Jilin University,Changchun 130012,Jilin,China;Hubei Key Laboratory of Optical Information and Pattern Recognition,Wuhan Institute of Technology,Wuhan 430205,Hubei,China)

机构地区：[1]吉林大学电子科学与工程学院集成光电子学国家重点实验室,吉林长春130012 [2]武汉工程大学光学信息与模式识别湖北省重点实验室,湖北武汉430205

出　　处：《中国激光》2024年第4期296-315,共20页Chinese Journal of Lasers

基　　金：国家自然科学基金(62375103,62131018);国家重点研发计划(2021YFF0502701);吉林省科技发展计划(20220301002GX,20230508110RC)。

摘　　要：得益于飞秒激光直写技术的穿透式真三维改性加工能力,多种介质内任意三维路径及截面形状的光波导得以实现并得到了重要应用。本文围绕飞秒激光直写光波导的机理及基本类型,综述了三维光波导器件在光通信、集成量子光学、拓扑光子学、天文光子学以及光学传感等领域的应用。从三维光子芯片的应用需求入手,总结了飞秒激光直写技术在低损耗、任意截面、大纵深直写和可重构三维波导制备中面临的挑战,并展望了飞秒激光直写三维光波导的未来发展趋势。Significance With the development of emerging applications,such as artificial intelligence(AI),automatic drive,and high-speed computing,the information transmission capacity and processing speed required by human society are increasing exponentially.Hence,photonics is expected to be a new approach to information transfer and processing in the future for the multiple-encoding degrees of freedom,low power consumption,ultrahigh-speed information transmission,and high parallelism in information processing.Compared with traditional bulky optical systems,photonic integrated circuits(PICs)have a low loss,multifunctionality,high degree of integration,and compact size.These advantages have attracted attention from scientists worldwide.Apart from the significant progresses made in two-dimensional(2D)PICs,a rapid development trend in three-dimensional(3D)PICs consisting of 2D and 3D waveguide devices is being witnessed.With its 3D processing capability,femtosecond-laser direct writing facilitates the transformation of PICs from 2D into 3D.This transformation provides not only a direct solution for the improvement of chip integration in the physical space but also new physical degrees-of-freedom design to achieve more complex on-chip photonic manipulation methods.Compared to 2D optical waveguide devices,3D optical waveguide devices offer a new three-dimensional architecture for photonic chips,enabling three-dimensional integration.By spatially combining waveguide devices,multiple degrees-of-freedom of photons can be fully achieved.By writing designed optical waveguide arrays,it is possible to construct Hamiltonians,enabling the direct simulation of quantum and topological phenomena in optical systems.With these advantages,3D PICs have important applications in various fields,including optical communications,integrated quantum optics,topological optics,astrophotonic,and optical sensing.Progress We reviewed the research progress of femtosecond-laser direct writing for 3D PICs.First,we introduced the mechanism of interaction be

关 键 词：集成光学 光子集成芯片 飞秒激光直写 三维光波导 

分 类 号：TN249[电子电信—物理电子学]