Understanding the Thermal Impedance of Silicone Rubber/Hexagonal Boron Nitride Composites as Thermal Interface Materials  

作　　者：Yuan Ji Shi-Da Han Hong Wu Shao-Yun Guo Feng-Shun Zhang Jian-Hui Qiu 

机构地区：[1]The State Key Laboratory of Polymer Materials Engineering,Sichuan Provincial Engineering Laboratory of Plastic/Rubber Complex Processing Technology,Polymer Research Institute,Sichuan University,Chengdu 610065,China [2]Institute of Chemical Materials,China Academy of Engineering Physics,Mianyang 621900,China [3]Department of Mechanical Engineering,Faculty of Systems Science and Technology,Akita Prefectural University,Akita 015-0055,Japan

出　　处：《Chinese Journal of Polymer Science》2024年第3期352-363,I0008,共13页高分子科学（英文版）

基　　金：financially supported by Sichuan Science and Technology Program (No.2022YFH0090);the Fundamental Research Funds for the Central Universities。

摘　　要：Silicone rubber(SR) composites are most widely used as thermal interface materials(TIMs) for electronics heat dissipation. Thermal impedance as the main bottleneck limiting the performance of TIMs is usually neglected. Herein, the thermal impedance of SR composites loaded with different levels of hexagonal boron nitride(h-BN) as TIMs was elaborated for the first time by the ASTM D 5470 standard test and finite element analysis. It was found that elastic modulus and surface roughness of SR composites increased with the increase of h-BN content, indicating that the conformity was reduced. When the assembly pressure was 0.69 MPa, there existed an optimal h-BN content at which the contact resistance was minimum(0.39 K·cm^(2)·W^(-1)). Although the decreased bond line thickness(BLT) by increasing the assembly pressure was beneficial to reduce the thermal impedance, the proper assembly pressure should be selected to prevent the warpage of the contact surfaces and the increase in contact resistance, according to the compression properties of the SR composites. This study provides valuable insights into fabrication of high-performance TIMs for modern electronic device applications.

关 键 词：Thermal interface materials Hexagonal boron nitride Thermal impedance SURFACES 

分 类 号：TB332[一般工业技术—材料科学与工程]