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作 者:樊斌锋 韩田莉 王庆福 彭肖林 裴晓哲 FAN Binfeng;HAN Tianli;WANG Qingfu;PENG Xiaolin;PEI Xiaozhe(Henan High Precision Copper Foil Industrial Technology Research Institute Co.Ltd.,Lingbao 472500,China)
机构地区:[1]河南高精铜箔产业技术研究院有限公司,河南灵宝472500
出 处:《中国有色冶金》2024年第2期63-68,共6页China Nonferrous Metallurgy
摘 要:电解铜箔因其具有强度高、延展性良好等优势被广泛应用于新能源领域,目前对于5μm电解铜箔性能的影响因素研究较少。本文采用单一变量法考察了PEG、HVP和HP等添加剂对Cu电沉积的影响,通过正交试验探究PEG、HVP和HP复合添加剂对5μm电解铜箔性能的影响,并对比了不同添加剂对5μm电解铜箔外观形貌的影响,得到如下结论:PEG和HVP具有增强极化的作用,且随着浓度的增加极化作用增强,HP具有去极化的作用,且随着浓度的增加去极化作用增强;通过正交试验得出的最优复合添加剂的浓度为PEG 0.36 g/L、HVP 0.12 g/L、HP 0.05 g/L,在此条件下得到的较佳性能为抗拉强度485.17 MPa、延伸率3.72%、粗糙度1.31;相比于单一添加剂,最优配比复合添加剂下的复合镀层表面更加均匀平整,且颗粒细小。Electrolytic copper foil has been widely used in the field of new energy because of its advantages of high strength and good ductility.At present,there are few studies on the factors affecting the performance of 5μm electrolytic copper foil.In this paper,the effects of PEG,HVP,HP and other additives on Cu electrodeposition were investigated by single variable method.The effects of PEG,HVP and HP compound additives on the performance of 5μm electrolytic copper foil were investigated by orthogonal test,and the effects of different additives on the appearance of 5μm electrolytic copper foil were compared.The following conclusions were reached:PEG and HVP can enhance the polarization,and the polarization increases with the increase of the concentration.HP can depolarization,and the depolarization increases with the increase of the concentration.The optimal concentration of the compound additive was PEG 0.36 g/L,HVP 0.12 g/L and HP 0.05 g/L,and the best properties were tensile strength 485.17 MPa,elongation 3.72%and roughness 1.31.Compared with a single additive,the surface of the composite coating under the optimal ratio of composite additive is more uniform and smooth,and the particles are fine.
关 键 词:5μm电解铜箔 铜沉积 复合添加剂 聚乙二醇(PEG) 水解蛋白(HVP) 醇硫基丙烷磺酸钠(HP) 铜箔性能 微观形貌
分 类 号:TF803.2[冶金工程—有色金属冶金] TG146.1[一般工业技术—材料科学与工程]
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