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作 者:彭伟[1] 关宏山[1] PENG Wei;GUAN Hongshan(No.38 Research Institute of CETC,Hefei 230088,China)
机构地区:[1]中国电子科技集团公司第三十八研究所,安徽合肥230088
出 处:《电子质量》2024年第3期52-56,共5页Electronics Quality
摘 要:为了对当前HDXM电子机箱高盐雾环境下的散热设计进行提优改良,通过对传统设计问题进行辨析,提出了两类热设计改型方式,规避了原设计方式存在的结构冗杂、重量过重和热效率偏低等问题,有序可控各维度特性,达到热设计工程优化效果。同时通过热仿真分析比对,验证了此机箱热设计的可靠性,为总体设计构架奠定了热技术基础,对于后继同性热设计具有一定的借鉴意义。In order to improve the heat dissipation design of the current HDXM chassis in high salt spray environment,two types of thermal design modification methods are proposed by discriminating the traditional design problems,which avoids the problems of the original design method,such as the structural complexity,heavy weight,and low thermal efficiency,and can orderly control the characteristics of each dimension,and achieve the optimization effect of thermal design engineering.At the same time,the reliability of the thermal design of this chassis is verified through thermal simulation analysis and comparison,which lays the foundation of thermal technology for the overall design framework and provides reference for subsequent thermal design with the same properties.
分 类 号:TN03[电子电信—物理电子学]
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