透明硬脆材料激光剥离关键问题研究(特邀)  

Research on key issues of laser splitting of transparent hard and brittle materials(invited)

作　　者：赵树森[1,2] 何宏智 韩世飞 姜璐 杜家宝 于海娟 林学春[1,2,4] 张谷令 Zhao Shusen;He Hongzhi;Han Shifei;Jiang Lu;Du Jiabao;Yu Haijuan;Lin Xuechun;Zhang Guling(Laboratory of All-Solid-State Light Sources,Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China;Engineering Technology Research Center of All-Solid-State Lasers Advanced Manufacturing,Beijing 100083,China;College of Science,Minzu University of China,Beijing 100081,China;College of Materials Science and Opto-Electronic Technology,University of Chinese Academy of Sciences,Beijing 100049,China)

机构地区：[1]中国科学院半导体研究所全固态光源实验室,北京100083 [2]北京市全固态激光先进制造工程技术研究中心,北京100083 [3]中央民族大学理学院,北京100081 [4]中国科学院大学材料科学与光电技术学院,北京100049

出　　处：《红外与激光工程》2024年第1期17-30,共14页Infrared and Laser Engineering

基　　金：国家重点研发计划项目(2022YFB3605800);国家自然科学基金项目(62225507,U2033211)。

摘　　要：透明硬脆材料由于其优异的力学性能、热稳定性、耐腐蚀性以及光电性能,广泛应用于半导体与电子领域。传统透明硬脆材料切片方法效率低、材料损耗大,制约了硬脆材料的推广应用。激光剥离技术是近年来新兴的一种透明硬脆材料切片新方法,较传统金刚线切割方法大幅提升硬脆材料的切片效率和材料利用率,目前已发展成为硬脆材料激光加工领域学术研究与产业应用的焦点。文中深入分析透明硬脆材料激光剥离物理过程,归纳激光剥离过程关键科学问题:透明硬脆材料对激光的非线性吸收、激光作用下材料内部微观结构演化与缺陷扩展规律,以及激光光场调控对材料改质影响机制等。基于这些科学问题,综述了近年来激光剥离不同类型透明硬脆材料的研究进展,目前用于激光剥离的材料已涵盖了SiC、Si、GaN、金刚石等半导体材料,蓝宝石、多晶Al_(2)O_(3)、氧化锆等陶瓷材料,激光剥离技术已发展出超快激光双脉冲诱导剥离、超快激光-化学辅助剥离、多激光复合剥离等。激光剥离物理过程是一个典型的激光-材料-热学-力学多学科交叉问题,尽管在实验结果方面获得了显著突破和迅猛发展,但目前对于工艺机理仍缺乏深入的理论与数值建模研究。未来透明硬脆材料激光剥离技术将会朝着百微米以下超薄厚度剥离、改质层低损伤、工艺自适应等方向发展,将为半导体与电子等领域快速发展提供更大的技术支撑。Significance Transparent hard brittle materials have been widely used in the fields of semiconductors and electronics due to their excellent mechanical properties,thermal stability,corrosion resistance,and optoelectronic properties.The traditional slicing method for transparent hard brittle materials has low efficiency and high material loss,which restricts the promotion and application of hard brittle materials.Diamond wire cutting is commonly used in the cutting of high-hardness and brittle materials.The existing substrate processing technology has slow cut speed,and there is a large loss of transparent and brittle materials and cutting lines.Every time a piece of transparent and brittle material is processed,a large amount of wire cutting loss will be caused by wire saw cutting,greatly increasing the cost of splitting transparent and brittle materials,The laser assisted separation technology,which leads to expensive separation processes,is a new method for slicing transparent hard brittle materials in recent years.It revolutionarily utilizes nonlinear optical effects to make laser pass through transparent hard brittle materials,causing a series of physical and chemical processes such as thermal damage and laser induced ionization inside the transparent hard brittle materials,forming a thin modified layer,and ultimately achieving the splitting of transparent hard brittle materials.Compared with traditional diamond wire cutting methods,it greatly improves the slicing efficiency and material utilization of hard and brittle materials.In the field of laser processing of hard and brittle materials,it has developed into a common focus of academic research and industrial applications.Progress This article provides an in-depth analysis of the physical process of laser separation of transparent hard brittle materials and summarizes the key scientific issues in the process of laser separation,which are the nonlinear absorption of laser by transparent hard brittle materials,the evolution of the internal microstructure of

关 键 词：超快激光 硬脆材料 剥离 非线性吸收 缺陷扩展 光场调控 

分 类 号：TN249[电子电信—物理电子学]