高强高导铜合金应用及研究进展  

Application and Research Progress of High Strength and High Conductivity Copper Alloys

作　　者：包雪鹏 徐品东 杨鹏波 李正锁 张栋 李庆国 BAO Xue-peng;XU Ping-dong;YANG Peng-bo;LI Zheng-Suo;ZHANG Dong;LI Qing-guo(Gansu Advanced Design and Manufacturing Technology Engineering Laboratory,Lanzhou 730030,Gansu,China;Gansu Academy of Mechanical Sciences Co.,Ltd,Lanzhou 730030,Gansu,China)

机构地区：[1]甘肃省先进设计与制造技术工程实验室,甘肃兰州730030 [2]甘肃省机械科学研究院有限责任公司,甘肃兰州730030

出　　处：《机械研究与应用》2024年第2期178-181,共4页Mechanical Research & Application

基　　金：甘肃省2022年中央引导地方科技发展资金项目:基于数字孪生技术的硅基合金材料生产物料管理系统研究与示范(编号:22ZY1QA007)。

摘　　要：该文重点介绍了高强高导铜合金的制备工艺技术及应用,并结合固溶+沉淀强化、细晶强化、形变强化、弥散强化、析出强化等强化方式分析了高强高导铜合金制备技术的应用特点,最后展望了高强高导铜合金的未来发展前景与方向,为高强高导铜合金新材料的开发提供思路和参考。This paper focuses on the preparation technology and application of high-strength and high conductivity copper alloy,analyzes the preparation technology of high strength and high conductivity copper alloy by combining the solid solution and precipitation strengthening,fine grain strengthening,deformation strengthening,dispersion strengthening,precipitation strengthening and other strengthening methods,and finally looks forward to the future development prospects and directions of high strength and high conductivity copper alloys.It can provide ideas and references for the development of new materials for high-strength and high-conductivity copper alloy in the future.

关 键 词：高强高导 铜合金 应用领域 制备技术 发展趋势 

分 类 号：TG146.11[一般工业技术—材料科学与工程]