基于COMSOL弯液面限域电沉积铜的仿真分析  

Simulation analysis on meniscus-confined electrodeposition of copper with COMSOL software

作　　者：刘磊 吕镖 王浩旭 刘增华 胡振峰 LIU Lei;LYU Biao;WANG Haoxu;LIU Zenghua;HU Zhenfeng(Department of Informatics,Beijing University of Technology,Beijing 100124,China;Defense Innovation Institute,Academy of Military Science,Beijing 100071,China;Unit 63723 of the Chinese People's Liberation Army,Xinzhou 036300,China)

机构地区：[1]北京工业大学信息学部,北京100124 [2]中国人民解放军军事科学院国防科技创新研究院,北京100071 [3]中国人民解放军63723部队,山西忻州036300

出　　处：《电镀与涂饰》2024年第4期9-17,共9页Electroplating & Finishing

摘　　要：[目的]为了更好地理解弯液面限域电沉积铜的动态过程,以硫酸铜溶液电沉积铜为研究对象,建立二维轴对称电沉积模型。[方法]使用COMSOL有限元软件对弯液面限域电沉积铜进行模拟,考虑多物理场协同作用,并研究了环境相对湿度、电压和沉积时间对动态电沉积铜的影响。[结果]环境相对湿度影响蒸发通量和离子通量,电压会改变阴极过电位,进而影响电沉积铜的品质和效率。随着电沉积时间的延长,弯液面的边缘铜沉积快于中心部位的铜沉积,出现边缘择优生长现象。[结论]通过调整弯液面限域电沉积铜的工艺参数可以优化电沉积铜的品质和效率。[Introduction]In order to understand the dynamic process of meniscus-confined electrodeposition of copper,a two-dimensional axisymmetric model for copper electrodeposition in a copper sulfate solution was established.[Method]The meniscus-confined electrodeposition of copper was simulated with COMSOL finite element software in consideration of the synergy of multiple physical fields.The effects of environmental relative humidity,voltage,and electrodeposition time on dynamic electrodeposition of copper were studied.[Result]The relative humidity of the environment affects the evaporation flux and ion flux,while the applied voltage has an impact on the quality and efficiency of copper electrodeposition by changing the cathode overpotential.With the extending of electrodeposition time,the copper deposition rate at the edge of the meniscus is higher than that of at the center,resulting in an edge-preferred growth.[Conclusion]The quality and efficiency of copper electrodeposition can be optimized by adjusting the process parameters of meniscus-confined electrodeposition.

关 键 词：铜 弯液面限域电沉积 相对湿度 电压 仿真分析 

分 类 号：TQ153.14[化学工程—电化学工业]