铝基板阳极氧化封孔工艺对覆铜板性能的影响  

Effect of sealing of anodic oxidation film on properties of aluminum-based copper clad laminate

作　　者：潘林铮 秦会斌[1] 周继军[1] 罗炜杰 PAN Linzheng;QIN Huibin;ZHOU Jijun;LUO Weijie(Institute of New Electron Device Application,Hangzhou Dianzi University,Hangzhou 310000,China)

机构地区：[1]杭州电子科技大学新型电子器件与应用研究所,浙江杭州310000

出　　处：《电镀与涂饰》2024年第4期32-39,共8页Electroplating & Finishing

基　　金：安徽省重点研究与开发计划项目(202004g01020003)。

摘　　要：[目的]探究铝基板阳极氧化封孔工艺对覆铜板性能的影响。[方法]先采用草酸对7075铝合金阳极氧化,再在真空条件下采用Al_(2)O_(3)溶胶或/和ZnO溶胶进行封孔处理,并在300℃下加热固化。研究了两种溶胶单独封孔或组合封孔及封孔次数对阳极氧化膜导热系数与耐电压强度的影响。此外,还采用封孔样品为基板,分别通过溅射镀铜与热压合工艺制备铝基覆铜板。[结果]采用Al_(2)O_(3)溶胶和ZnO溶胶交替封孔4次可将阳极氧化膜的耐电压强度提升2.90倍左右,但会使其导热性略微变差。通过溅射镀铜所得覆铜板的剥离强度高达1.15N/mm,并且耐热性良好。[结论]对铝基板进行阳极氧化封孔能够显著改善覆铜板的性能。[Introduction]The effect of anodizing and sealing of aluminum substrate on the properties of copper clad laminates.[Method]The 7075 aluminum alloy was initially anodized with oxalic acid,and then sealed with Al_(2)O_(3)sol or/and ZnO sol under vacuum,and finally cured at 300℃.The effects of sealing with Al_(2)O_(3)sol,ZnO sol or both of them,and sealing time on the thermal conductivity and withstanding voltage of anodic oxidation film were studied.Copper clad laminates were also prepared using the anodized and sealed aluminum alloy as substrate by magnetron sputtering or thermal compression bonding with copper.[Result]After being sealed with Al_(2)O_(3)sol and ZnO sol alternatively for 4 times,the withstanding voltage of anodic oxidation film was increased by about 2.90 times,but the thermal conductivity was slightly decreased.The copper clad laminate prepared by magnetron sputtering copper featured a peeling strength up to 1.15 N/mm and excellent thermal resistance.[Conclusion]Anodization and sealing of aluminum-based substrate can greatly improve the properties of copper clad laminate.

关 键 词：铝基覆铜板 阳极氧化 封孔 溶胶 氧化铝 氧化锌 剥离强度 耐热性 

分 类 号：TQ153.6[化学工程—电化学工业]