丙烯酸酯基导电压敏胶研究进展  

Research progress in acrylate-based conductive pressure sensitive adhesive

作　　者：徐丹 张军营[2] 牛栋华 宋佳赟 刘彤 程珏[2] Xu Dan;Zhang Junying;Niu Donghua;Song Jiayun;Liu Tong;Cheng Jue(Beijing Tianyu Aerospace New Material Technology Co.,Ltd.,Beijing 101407,China;College of Materials Science and Engineering,Beijing University of Chemical Technology,Beijing 100020,China)

机构地区：[1]北京天宇航天新材料科技有限公司,北京101407 [2]北京化工大学材料科学与工程学院,北京100020

出　　处：《中国胶粘剂》2024年第4期10-18,共9页China Adhesives

摘　　要：综述了丙烯酸酯基导电压敏胶的三类填料的研究进展,包括金属填料、无机非金属填料以及杂化填料。对丙烯酸酯基导电压敏胶的结构设计进行了汇总,包括在丙烯酸酯基础上接入氨基甲酸酯键、环氧基团的导电压敏胶。最后对丙烯酸酯基导电压敏胶未来发展进行了展望。The research progress of three types of fillers for acrylate-based conductive pressure sensitive adhesive,including metal fillers,inorganic non-metallic fillers,and hybrid fillers were reviewed.The structural design of acrylate-based conductive pressure sensitive adhesive,which includes accessing to urethane bond and epoxy group on the basis of acrylate-based conductive pressure sensitive adhesive was summarized.Finally,the future development of acrylate-based conductive pressure sensitive adhesive was prospected.

关 键 词：导电压敏胶 丙烯酸酯 导电填料 

分 类 号：TQ436[化学工程]