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作 者:曾照明 万垂铭 肖国伟 林宏伟 王洪 ZENG Zhaoming;WAN Chuiming;XIAO Guowei;LIN Hongwei;WANG Hong(APt Electronics Co.Ltd.Guangzhou 511458,China;Engineering Research Center for Optoelectronics,School of Physics,South China University of Technology,Guangzhou 510640,China;School of Microelectronics,South China University of Technology,Guangzhou 510640,China)
机构地区:[1]广东晶科电子股份有限公司,广东广州511458 [2]华南理工大学物理与光电学院广东省光电工程技术研究开发中心,广东广州510640 [3]华南理工大学微电子学院,广东广州510640
出 处:《发光学报》2024年第3期516-523,共8页Chinese Journal of Luminescence
基 金:广州市科技计划项目(202103030002);广州南沙区重点领域科技项目(2021ZD001)~~。
摘 要:大功率白光LED封装主要分为玻璃荧光片封装和荧光粉胶封装。本文提出一种用荧光胶封装大功率白光LED的方法,优化白光LED的发光面的均匀性,并分析了荧光胶封装和用荧光片封装的大功率白光LED的光热性能。实验结果表明,在1 400 mA电流驱动下,荧光胶封装白光LED的光通量为576.07 lm,比荧光片封装白光LED的光通量高15.5%,光转换效率为35.8%。在温度从25℃提升到125℃的过程中,荧光胶封装器件的亮度衰减了20%,色温从5 882.11 K提高到6 024.22 K。荧光胶封装的白光LED在常温下的热阻为1.7 K/W,与玻璃荧光片封装的热阻接近。在840 h高温高湿老化和1 600 h高温老化实验中,荧光胶封装的相对光衰均能稳定在97%。The primary packaging of high-power white LEDs(WLEDs)is divided into phosphor-in-glass(PiG)package and phosphor-in-silicone(PiS)package.We proposed a PiS packaging method to optimize the uniformity of the light-emitting surface of high-power WLEDs,and analyze the photothermal performance.The experimental re⁃sults show that the luminous flux of the WLED packaged by PiS is 576.07 lm at 1400 mA,which is 15.5%higher than that of the WLED packaged by PiG.During the process of temperature increase from 25℃to 125℃,the lumi⁃nance of the PiS packaged device decreased by 20%,and the color temperature increased from 5882.11 K to 6024.22 K.The thermal resistance of the PiS package is 1.7 K/W at 25℃,which is close to that of the PiG pack⁃age.The relative light intensity of PiS package remains stable at 97%during 840 h of high temperature and high hu⁃midity aging and 1600 h of high temperature aging test.
关 键 词:大功率白光LED 玻璃荧光片 荧光粉胶 光热性能 热稳定性
分 类 号:TN312.8[电子电信—物理电子学]
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