电真空器件隙缝腔零件微细加工技术工艺研究  

Research on Micro-machining Technology of Crevice Cavity Parts for Vacuum Electronic Devices

作　　者：陈兵 张德水 于森 CHEN Bing;ZHANG De-shui;YU Sen(Beijing Vacuum Electronics Research Institute,Beijing 100015,China)

机构地区：[1]中国电子科技集团公司第十二研究所,北京100015

出　　处：《真空电子技术》2024年第2期102-105,共4页Vacuum Electronics

摘　　要：针对G波段分布作用速调管中关键零件隙缝腔零件的高精度设计要求开展微细加工技术研究。基于现有加工经验及加工设备条件,通过创新性的工艺设计、结合大量工艺试验探索,突破了微小尺寸、超高精度零件的精密加工技术,满足了毫米波及太赫兹电真空器件中关键零部件的制造需求,提升了高频段电真空器件制造技术水平。Research on micro-machining technology is carried out to meet the high-precision design requirements of key crevice parts for G-band distributed klystrons.Based on existing processing experience and equipment conditions,through innovative process design and extensive process experiments,the precision machining technology of small-sized and ultra-high precision parts is developed,which can meet the manufacturing requirements of key parts for millimeter-wave and terahertz vacuum electronic devices,thus improving the manufacturing technology level of high frequency vacuum electronic devices.

关 键 词：微细加工 加工工艺 隙缝腔 精密零件 

分 类 号：TP273[自动化与计算机技术—检测技术与自动化装置]