虑及颗粒-基体摩擦行为影响的SiC_(p)/Al切削仿真研究  

Simulation of SiC_(p)/Al Cutting Considering Effect of Particle-matrix Friction Behavior

作　　者：缪凯强 段春争[1] 印文典 杨龙允 江冬圆 吴子乾 Miao Kaiqiang;Duan Chunzheng;Yin Wendian;Yang Longyun;Jiang Dongyuan;Wu Ziqian(College of Mechanical Engineering,Dalian University of Technology,Dalian,Liaoning 116024,China;不详)

机构地区：[1]大连理工大学机械工程学院,辽宁省大连市116024 [2]航空工业成都飞机工业(集团)有限责任公司

出　　处：《工具技术》2024年第4期19-24,共6页Tool Engineering

基　　金：国家自然科学基金(52275409,U1908231)。

摘　　要：摩擦系数是影响切削过程中切削力、切削热以及已加工表面形貌的重要参数。通过搭建力—热可控摩擦实验平台,探究温度—压力影响下SiC_(p)/Al切削过程中颗粒—基体两相摩擦行为。基于摩擦工件表面粗糙度与表面形貌,揭示了温度—压力影响机理。结果表明,温度—压力作用本质是影响SiC颗粒磨削深度;摩擦系数受压力影响较大,而温度、压力与颗粒自锐性三者的共同作用决定摩擦后工件表面粗糙度。考虑颗粒—基体摩擦行为影响的SiC_(p)/Al切削仿真模型能有效预测切削力,平均误差为3.28%;提高切削速度可有效改善SiC颗粒犁耕基体形成的三角形缺陷宽度,平均减少38.3%。该研究为进一步理解SiC_(p)/Al切削过程中的摩擦特性与提高仿真预测精度提供了理论基础。Friction coefficient is the main factor that affects cutting force,cutting heat and surface morphology.In this paper,by setting up a force-heat controllable friction experimental platform,the particle-matrix friction behavior in SiC_(p)/Al cutting process under the influence of temperature and pressure is investigated.Based on the surface roughness and surface morphology of friction workpiece,the influence mechanism of temperature and pressure is revealed.The results show that the essence of temperature-pressure effect is to affect the grinding depth of SiC_(p)articles.The friction coefficient is greatly affected by the pressure effect,and the combined action of temperature,pressure and particle self-sharpening determines the workpiece surface roughness after friction.The SiC_(p)/Al cutting simulation model considering the effect of particle-matrix friction behavior can effectively predict the simulation cutting force,and the average error is 3.28%.Increasing the cutting speed can effectively improve the triangular defect width formed by SiC_(p)articles ploughing matrix,and reduce by 38.3%on average.This study provides a theoretical basis for further understanding of friction characteristics in SiC_(p)/Al cutting process and improving simulation prediction accuracy.

关 键 词：SiC_(p)/Al 温度—压力作用 颗粒—基体摩擦行为 有限元仿真 

分 类 号：TG501[金属学及工艺—金属切削加工及机床] TH16[机械工程—机械制造及自动化]