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作 者:薛润东[1] 方锡祯 Xue Rundong;Fang Xizhen(Institute for Advanced Materials and Technology,University of Science and Technology Beijing,Beijing 100083,China;School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China)
机构地区:[1]北京科技大学新材料研究院,北京100083 [2]北京科技大学材料科学与工程学院,北京100083
出 处:《金属热处理》2024年第4期78-82,共5页Heat Treatment of Metals
基 金:江西省中央引导地方科技发展资金项目(2022ZDD03079)。
摘 要:采用背散射电子衍射技术(EBSD)对无Cu与含Cu高硅无取向硅钢热处理过程的织构进行了检测,分析了微量Cu元素对高硅无取向硅钢织构的影响,并对其微观机理进行了探究。结果表明,在1000℃高温再结晶退火时,添加微量Cu元素对硅钢成品的织构起到明显的恶化作用;高温退火工艺可以更充分发挥剪切带优化织构的作用,但含微量Cu元素的无取向硅钢对剪切带优化织构有明显的抑制作用,其原因与基体中弥散析出的含Cu析出相有关。Effect of copper content on the texture of two high-silicon non-oriented silicon steels without Cu and with trace Cu was analyzed by EBSD technology,and the microscopic mechanism was also investigated.The results indicate that after high temperature annealing at 1000℃,the addition of trace Cu element has an obvious harmful effect on the texture of finished silicon steel product.The high temperature annealing process plays a more full role in optimizing the texture by the shear bands,while such optimizing effect is inhibited obviously by adding of trace Cu to the non-oriented silicon steel,which is attributed to the dispersive distribution of the copper precipitates in the steel matrix.
分 类 号:TG141[一般工业技术—材料科学与工程]
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