银铜侧向复合材料界面结合机理分析  

Analysis of Interface Bonding Mechanism of Silver-Copper Lateral Composite Prepared by Coated Ingot

作　　者：宁德魁[1,2] 谢明 陈永泰[1,2] 段云昭 刘国化[2] 马洪伟 NING Dekui;XIE Ming;CHEN Yongtai;DUAN Yunzhao;LIU Guohua;MA Hongwei(Kunming Institute of Precious Metals,Kunming 650106,China;Yunnan Precious Metals Lab Co.,LTD.,Kunming 650106,China)

机构地区：[1]昆明贵金属研究所,云南昆明650106 [2]云南贵金属实验室有限公司,云南昆明650106

出　　处：《铜业工程》2024年第2期61-65,共5页Copper Engineering

基　　金：云南贵金属实验室科技计划项目(YPML-2022050229)资助。

摘　　要：本文采用“包覆锭坯+扩散烧结+冷轧复合”联合工艺制备了银铜侧向复合带材,利用金相显微镜(OM)、扫描电镜(SEM)和能谱仪(EDS)观察分析银铜复合界面结构和元素分布,并分析其银铜复合界面的结合机理。结果表明,银铜复合界面形成过程为:1)银铜接触界面处凹凸不平的表面在轧制力的作用下相互咬合,形成机械结合界面;2)接触面在轧制力的作用下,银铜表面氧化膜破裂,新鲜表面质点间在轧制变形热的作用下产生原子结合;3)在扩散烧结过程中,银铜界面处的原子在高温作用下被激活,银铜原子相互扩散,在界面处发生银铜共晶反应形成液相金属层,随着烧结时间的延长,其共晶反应液相层厚度逐渐增加,随后冷凝结晶,使银铜实现侧向冶金结合。4)在后续中间退火过程中,共晶层与两侧的铜、银基体相互扩散,铜、银原子向更深的方向逐渐扩散,在靠近共晶层铜侧和银侧逐步形成固溶体层,使银与铜的结合强度进一步提高。银铜侧向复合界面结合机理包含机械咬合结合、接触共晶反应自钎焊结合和原子扩散结合3种,复合界面结合强度较好,剪切强度达220 MPa。In this paper,silver-copper lateral composite strip was prepared by the process of"coated ingot billet diffusion sintering and cold rolling composite".The interfacial bonding strength of silver-copper composite strip was tested by material tensile testing machine.The interfacial structure of silver-copper composite strip was observed by metallographic microscope,scanning electron microscope and energy spectrum,and the structure and bonding mechanism of silver-copper composite strip were analyzed.The results show that the forming process of silver-copper composite interface was as follows:1)Silver and copper contacted each other under the action of rolling force;2)The uneven surfaces at the silver-copper contact interface bit each other under the action of rolling force,forming a mechanical bonding interface;3)Under the action of rolling force,the oxide film on the surface of silver-copper was broken,and atomic bonding occurs between fresh surface particles under the action of rolling deformation heat;4)In the process of diffusion sintering,the atoms at the silver-copper interface were activated under the action of high temperature,and the silver-copper atoms diffused with each other,so that the silver and copper achieved metallurgical bonding at the connecting surface.The bonding mechanism of the silver-copper lateral composite interface included two kinds of bonding mechanisms:mechanical occlusion bonding and atomic diffusion bonding.The bonding strength of the composite interface was good,and the shear strength of the composite interface was 220 MPa.

关 键 词：包覆锭坯 银铜复合材料 界面结合机理 共晶接触反应钎焊 微观组织 

分 类 号：TG146.3[一般工业技术—材料科学与工程]