不同介质厚度对PCB特性阻抗测试结果的影响  

Influence of Different Dielectric Thickness on Test Results of PCB Characteristic Impedance

作　　者：黄少奇 HUANG Shao-qi(School of Mechanical Engineering,Anhui University of Science&Technology,Huainan 232001,China)

机构地区：[1]安徽理工大学机械工程学院,安徽淮南232001

出　　处：《机械工程与自动化》2024年第3期11-13,17,共4页Mechanical Engineering & Automation

基　　金：国家自然科学基金资助项目(52275228)。

摘　　要：印制电路板(PCB)最终产品除了要保证其短路、断路合格以外,还要保证阻抗值满足电性能要求。PCB中的阻抗是指传输线路的特性阻抗,在高速高频电路中,只有特性阻抗与负载阻抗匹配,信号的反射才最小,完整性更高。在设计阻抗时常使用PolarSi9000软件进行模拟计算来得到PCB相关设计参数,然而在实际生产过程中常出现实测阻抗值与模拟值存在差异的情况。通过理论分析、实验设计、实验总结及分析等介绍了印制电路板层间介质厚度对实测阻抗的影响,为PCB阻抗设计提供了一定的解决方案。The final product of printed circuit board(PCB)should not only ensure that its short circuit and open circuit are qualified,but also ensure that the impedance value meets the electrical performance requirements.The impedance in PCB refers to the characteristic impedance of the transmission line.In the high-speed and high-frequency circuit,only the characteristic impedance matches the load impedance,the reflection of the signal is minimum and the integrity is higher.In the design impedance,PolarSi9000 software is often used to simulate and calculate the relevant design parameters of PCB.However,in the actual production process,there is often a difference between the measured impedance value and the simulated value.Through theoretical analysis,experimental design,experimental summary and analysis,this paper introduces the influence of interlayer dielectric thickness of printed circuit board on the measured impedance,which provides a certain solution for PCB impedance design.

关 键 词：印制电路板 PolarSi9000 特性阻抗 介质厚度 

分 类 号：TN41[电子电信—微电子学与固体电子学]