PCBA板上元器件失效分析方法研究  

Research on Failure Analysis Method for Component on PCBA Board

作　　者：马勇 张少华 何静 林晓会 MA Yong;ZHANG Shaohua;HE Jing;LIN Xiaohui(The 58th Research Institute of CETC,Wuxi 214035,China)

机构地区：[1]中国电子科技集团公司第五十八研究所,江苏无锡214035

出　　处：《电子质量》2024年第4期80-85,共6页Electronics Quality

摘　　要：针对印刷电路板组件上(PCBA)上元器件失效分析难度大、流程复杂和效率不高等问题,通过理论与案例相结合的方式,提出了一种PCBA板上元器件失效分析方法。按照“先非破坏性后破坏性、先外部后内部”的思路,通过元器件在板测试、拆机测试和开封分析等方法,提出了一种板上元器件失效分析流程,进一步提升了板上元器件失效分析的效率,为PCBA板上元器件产品更新迭代和高效率分析使用提供了参考。Aiming at the great difficulty,complex process and low efficiency of failure analysis of component on PCBA board,a failure analysis method of component on PCBA board is proposed through a combination of theory and case.Following the approach of“non-destructive before destructive,external before internal”,a failure analysis process for on-board components is proposed through methods such as component on board testing,disassembly testing,and open package analysis,which further improves the efficiency of on-board component failure analysis and provides a reference for the iteration and efficient analysis and use of PCBA component products.

关 键 词：印刷电路板组件 元器件 失效分析方法 非破坏性分析 破坏性分析 在板测试 拆机测试 开封分析 

分 类 号：TN41[电子电信—微电子学与固体电子学]