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作 者:孙星星 魏运召[1] 赵汉清[1] 尹杰 王冠[1] 付刚[1] 赵玉宇[1] 吴健伟[1] SUN Xingxing;WEI Yunzhao;ZHAO Hanqing;YIN Jie;WANG Guan;FU Gang;ZHAO Yuyu;WU Jianwei(Institute of Petrochemistry,Heilongjiang Academy of Sciences,Harbin 150040,China)
机构地区:[1]黑龙江省科学院石油化学研究院,黑龙江哈尔滨150040
出 处:《粘接》2024年第5期17-20,共4页Adhesion
摘 要:以间二乙炔基苯和甲基苯基二氯硅烷采用格氏试剂法合成了甲基苯基含硅芳炔(MPSA)树脂,进行了红外(FT-IR)、核磁(^(1)H-NMR)、热性能和流变特性分析表征,通过MPSA与聚酰亚胺树脂共混制备胶粘剂,以差示扫描量热法(DSC)、热失重分析(TGA)研究胶粘剂的固化性能、耐热性能,测试了胶粘剂室温和高温剪切强度。结果表明,制备的MPSA树脂显示出优异的耐热性和加工性,室温到210℃黏度在10Pa·s以下,5%热失重温度(T_(d5))为583℃,800℃残碳率(Y_(r800))为88%。聚酰亚胺树脂改性的MPSA胶粘剂显示出较高的高温粘接性能和良好的高温热稳定性,T_(d5)在564~573℃,Y_(r800)在80%~85%,其中AtPI:MPSA=5:5胶粘剂的室温和450℃剪切强度分别达到10.7MPa和7.5MPa。Methylphenyl silicon-containing arylacetylene(MPSA)resin was synthesized with m-diethynylbenzene and methylphenyldichlorosilane by Grignard reagent method,the infrared(FT-IR),nuclear magnetic resonance(^(1)H-NMR),thermal properties and rheological properties were analyzed and characterized,the adhesive was prepared by blending MPSA and polyimide resin,the curing performance and heat resistance of the adhesive were studied by differential scanning calorimetry(DSC)and thermogravimetric analysis(TGA),and the shear strength of the adhesive was tested at room temperature and high temperature.The results showed that the prepared MPSA resin exhibited excellent heat resistance and processability,with a viscosity of less than 10 Pa•s from room temperature to 210°C,a 5%thermogravimetric temperature(T_(d5))of 583 C,and a carbon residual rate of 800℃(Y_(r800))of 88%.The polyimidemodified MPSA adhesive showed elevated bonding performance at high temperature and good thermal stability,with a 5%thermogravimetric temperature at 564~573℃C and char yield of 80%~85%at 800 C.The shear strength at room temperature and 450 C of AtPI:MPSA=5:5 adhesive was 10.7 MPa and 7.5 MPa respectively.
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