检索规则说明:AND代表“并且”;OR代表“或者”;NOT代表“不包含”;(注意必须大写,运算符两边需空一格)
检 索 范 例 :范例一: (K=图书馆学 OR K=情报学) AND A=范并思 范例二:J=计算机应用与软件 AND (U=C++ OR U=Basic) NOT M=Visual
作 者:张超 李飞宇 彭子峰 ZHANG Chao;LI Feiyu;PENG Zifeng(Engineering Construction Headquarters,Guangdong Airport Management Group Co.,Ltd.,Guangzhou 510000,China)
机构地区:[1]广东省机场管理集团有限公司工程建设指挥部,广东广州510000
出 处:《化学与粘合》2024年第3期264-268,共5页Chemistry and Adhesion
摘 要:合成了一种具有增强热稳定性和降低热导率的新型绝缘材料。首先制备了聚(亚胺硅氧烷)PIS,并通过硅氢化反应交联得到半固态交联PIS。研究了交联PIS的热分解温度、导热系数、光学透明度和介电常数,并与商用晶体管硅凝胶进行了比较。交联PIS的T_(5)和T_(10)值分别为416℃和454℃,商用硅凝胶的T5和T10值分别为378℃和422℃,表明交联PIS的热稳定性高于商用硅凝胶。交联PIS的导热系数为0.11 W/m·K,远低于商用硅凝胶的导热系数(0.19 W/m·K)。此外,交联PIS的介电常数为2.11,是一种低介电材料,在550 nm处表现出超过90%的高透光率。基于这些特性,交联PIS可以用作不间断电源晶体管的绝缘层。A new insulating material with enhanced thermal stability and reduced thermal conductivity has been synthesized.Firstly,the poly(imide siloxane)is prepared and cross-linked by hydrosilylation to obtain semi-solid cross-linked PIS.The thermal decomposition temperature,thermal conductivity,optical transparency and dielectric constant of crosslinked PIS are studied and compared with commercial silicon gels.The T_(5) and T_(10) values of cross-linked PIS are 416℃and 454℃,respectively,and the T5 and T10 values of commercial silicon gels are 378℃ and 422℃,respectively,indicating that the thermal stability of cross-linked PIS is better than that of commercial silicon gels.The thermal conductivity of crosslinked PIS is 0.11 W/m·K,which is much lower than that of commercial silicon gels(0.19 W/m·K).In addition,the crosslinked PIS is a low dielectric material with a dielectric constant of 2.11,and it exhibits a high transmittance of over 90%at 550 nm.Based on these properties,the crosslinked PIS can be used as an insulating layer for the uninterruptible power transistors.
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在链接到云南高校图书馆文献保障联盟下载...
云南高校图书馆联盟文献共享服务平台 版权所有©
您的IP:18.216.25.231