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作 者:黄国平 钟成 王晓卫 孟辉 HUANG Guoping;ZHONG Cheng;WANG Xiaowei;MENG Hui(Nanjing Technology Center,Shenzhen Zhenhua Microelectronics Co.,Ltd.,Nanjing 210001,China)
机构地区:[1]深圳市振华微电子有限公司南京技术中心,江苏南京210001
出 处:《新技术新工艺》2024年第4期12-19,共8页New Technology & New Process
基 金:电子元器件科研项目(ZHXP023-1)。
摘 要:为了研究Mg、Zn元素对Cu/Al复层材料界面中间相的影响,对Cu/Al复层材料进行退火热处理,通过XRD、扫描电镜和EDX能谱检测的方法对界面中间相进行分析,得到Mg、Zn元素对Cu/Al复层材料界面中间相分布规律和界面层断裂位置的影响结果。最后得出结论:完成300℃×5 h的退火热处理后,当界面为纯铜/纯铝时,Cu/Al界面处仅生成CuAl_(2)相,界面层断裂发生在铜基体和CuAl_(2)相之间;当界面为纯铜/铝合金时,在Mg、Zn元素的作用下,Cu/Al合金界面处并没有CuAl_(2)相生成。完成400℃×5 h的退火热处理后,Cu/Al界面中间相分布均为Cu_(9)Al_(4)和CuAl_(2),但其厚度的分布有所差异,此时Mg元素和Zn元素的作用均不明显。完成500℃×5 h的退火热处理后,当界面为纯铜/纯铝时,Cu/Al界面中间相分布为Cu_(9)Al_(4)、CuAl和CuAl_(2),界面层断裂发生在CuAl相或CuAl_(2)相和Cu_(9)Al_(4)相之间;当界面为纯铜/铝合金时,主要在Mg元素的作用下,此时Zn元素的作用并不明显,Cu/Al界面中间相分布变为Cu_(9)Al_(4)、CuAl、Al_(5)Cu_(6)Mg_(2)和CuAl_(2),界面层断裂发生在CuAl_(2)相或CuAl相和CuAl_(2)相之间。In order to study the influence of Mg and Zn elements on the interfacial mesophase of Cu/Al multilayer materials,the Cu/Al multilayer materials were annealed,and the interfacial mesophase was analyzed by XRD,SEM and EDX energy spectrum detection methods,so it was obtained that the results of the influence of Mg and Zn elements on the distribution law of interfacial mesophase for Cu/Al multilayer materials and the fracture position of interfacial layer.Finally,the conclusions are drawn,that was,after annealing at 300℃×5 h,when the interface was pure copper/pure aluminum,only CuAl_(2)phase was generated at the Cu/Al interface,and the interface layer fracture occurred between the copper matrix and CuAl_(2)phase.When the interface was pure copper/aluminum alloy,no CuAl_(2)phase was formed at the interface of Cu/Al alloy under the action of Mg and Zn elements.After annealing at 400℃×5 h,the mesophase uniform distribution of Cu/Al interface was Cu_(9)Al_(4)and CuAl_(2),but their thickness distribution was different,the effects of Mg and Zn were not obvious at this time.After annealing at 500℃×5 h,when the interface was pure copper/pure aluminum,the mesophase distribution of Cu/Al interface was Cu_(9)Al_(4),CuAl and CuAl_(2),the interface layer fracture occurred in CuAl phase or between CuAl_(2)phase and Cu_(9)Al_(4)phase.When the interface was pure copper/aluminum alloy,mainly under the action of Mg element,the effect of Zn element was not obvious at this time,the mesophase distribution of Cu/Al interface became Cu_(9)Al_(4),CuAl,Al_(5)Cu_(6)Mg_(2)and CuAl_(2),the interface layer fracture occurred in CuAl_(2)phase or between CuAl phase and CuAl_(2)phase.
关 键 词:Cu/Al复层材料 Mg、Zn元素 退火 界面 中间相
分 类 号:TB331[一般工业技术—材料科学与工程]
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