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作 者:吴珍珍 乔书杰[1] 韩涛[1] 王浩昌 张飘飘 闫海鹏 WU Zhenzhen;QIAO Shujie;HAN Tao;WANG Haochang;ZHANG Piaopiao;YAN Haipeng(School of Intelligent Engineering,Zhengzhou College of Finance and Economics,Zhengzhou 450000,China;School of Mechanical Engineering,Hebei University of Science and Technology,Shijiazhuang 050018,China)
机构地区:[1]郑州财经学院智能工程学院,郑州450000 [2]河北科技大学机械工程学院,石家庄050018
出 处:《现代制造工程》2024年第5期80-85,共6页Modern Manufacturing Engineering
基 金:河北省自然科学基金项目(E2021208004);河南省科技攻关项目(222102220091)。
摘 要:纳米磨削作为实现单晶硅低损伤加工的技术之一被逐渐应用于硅片减薄中,但磨削过程中的力热行为及其对亚表面损伤形成的影响机制仍不清楚;因此,通过分子动力学仿真手段对单晶硅纳米磨削时的力热行为和亚表面损伤之间的联系进行研究。结果表明,单晶硅纳米磨削过程中切向磨削力对材料去除起主要作用,磨粒前下方区域的热量聚集和应力集中现象明显。在力热载荷作用下,非晶化和相变是单晶硅纳米磨削时亚表面损伤的主要形成机制。磨削力的增大会导致单晶硅去除过程中产生较大的亚表面损伤层,而一定的高温由于增强了单晶硅的韧性进而抑制了亚表面损伤层的形成。Nano-grinding has been gradually applied to wafer thinning as one of the techniques to achieve low-damage processing of single crystal silicon,but the force-thermal behavior and its effect mechanism on subsurface damage formation are still unclear in the grinding process.Therefore,the connection between force-thermal behavior and subsurface damage during nano-grinding of single crystal silicon was investigated by molecular dynamics simulations.The results showed that the tangential grinding force plays a major role in material removal during nano-grinding of single crystal silicon,and the phenomenon on heat accumulation and stress concentration is obvious in the area below the front of the grit.Amorphization and phase transition are the main mechanisms of subsurface damage formation during nano-grinding of single crystal silicon under force-thermal loading.The increase in grinding force leads to a larger subsurface damage layer during removal,while a certain high temperature inhibits the formation of subsurface damage layer by enhancing the toughness of single crystal silicon.
关 键 词:单晶硅 纳米磨削 分子动力学 力热行为 亚表面损伤
分 类 号:TH161[机械工程—机械制造及自动化] TG58[金属学及工艺—金属切削加工及机床]
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