Micro-LED芯片激光去除机理及工艺参数优化  

Mechanism for laser-induced damage bad chip of Micro-LED and optimization of processing parameters

作　　者：乔健 吴振铎 彭信翰 冉雨宣 杨景卫 QIAO Jian;WU Zhenduo;PENG Xinhan;RAN Yuxuan;YANG Jingwei(Guangdong Provincial Key Laboratory of Industrial Intelligent Inspection Technology,Foshan University,Foshan 528000,China;Shenzhen Hymson Laser Intelligent Equipments Co.,Ltd.,Shenzhen 518000,China;Ji Hua Laboratory,Foshan 528200,China)

机构地区：[1]佛山科学技术学院,广东省工业智能检测技术重点实验室,广东佛山528000 [2]深圳市海目星激光智能装备股份有限公司,广东深圳518000 [3]季华实验室,广东佛山528200

出　　处：《光学精密工程》2024年第9期1360-1370,共11页Optics and Precision Engineering

基　　金：深圳市科技计划资助项目(No.KJZD20231023092302006);广东省重点建设学科科研能力提升项目(No.2022ZDJS042)。

摘　　要：为提高面板级Micro-LED显示面板的制造质量,需要对不良Micro-LED芯片进行原位去除与修复,利用COMSOL建立激光双温烧蚀模型,开展了Micro-LED不良芯片激光去除机理和工艺参数的优化。通过单脉冲激光对MicroLED芯片烧蚀所形成表面光斑的直径平方来推算Micro-LED的烧蚀阈值,拟合出激光参数与烧蚀深度的关系,并对双温烧蚀模型的准确性进行验证;分析了激光光斑重叠率、能量密度和不同扫描路径下对应芯片的烧蚀特征及去除机理,结合双温烧蚀模型完成了激光扫描路径及对应工艺参数的优化。结果表明,飞秒激光烧蚀模型对Micro-LED芯片激光烧蚀加工的最大分析误差为9.28%,优化的激光去除模式实现了1秒/颗的快速精准剥离和焊盘表面的高质量整平修复,对大幅面Micro-LED显示面板规模化生产中不良芯片的快速修复具有重要的指导作用。To improve the manufacturing quality of Micro-LED display panels,it is crucial to perform insitu removal and repair of defective chips.This study introduces a laser two-temperature ablation model de⁃veloped with COMSOL to explore the mechanisms and process parameters for eliminating defective chips using a laser.Initially,the ablation threshold of the Micro-LED was identified by measuring the square di⁃ameter of the surface spot created by a single-pulse laser ablation.A fitting analysis was then carried out to determine the relationship between laser parameters and ablation depth,confirming the accuracy of the two-temperature ablation model.An extensive analysis was also conducted to examine the laser spot overlap rate,laser fluence,ablation characteristics,and removal mechanisms for different scanning paths on the affected chips.Utilizing the two-temperature ablation model,the laser scanning path and process pa⁃rameters were optimized.The findings reveal that the femtosecond laser ablation model for Micro-LED has a maximum analytical error of 9.28%.The optimized laser removal method allows for rapid and pre⁃cise removal at a rate of 1 s/chip,while ensuring high-quality repair of pad surfaces.This provides essen⁃tial guidance for efficient repair processes in large-scale production environments of large-format Micro⁃LED display panels.

关 键 词：飞秒激光 原位去除 微发光二极管显示器 不良芯片 

分 类 号：TN249[电子电信—物理电子学]