基于导星纳米对准的片上光子引线直写技术  

On-Chip Photonic Lead Direct Writing Technology Based on Nano-Alignment Guide Star

作　　者：孙伯文 周国尊 杨振宇[1,3] 卞殷旭[1,2,3] 匡翠方 刘旭[1,2,3] Sun Bowen;Zhou Guozun;Yang Zhenyu;Bian Yinxu;Kuang Cuifang;Liu Xu(State Key Laboratory of Extreme Photonics and Instrumentation,Zhejiang University,Hangzhou 310027,Zhejiang,China;ZJUHangzhou Global Scientific and Technological Innovation Center,Zhejiang University,Hangzhou 311215,Zhejiang,China;College of Optical Science and Engineering,Zhejiang University,Hangzhou 310027,Zhejiang,China)

机构地区：[1]浙江大学极端光学技术与仪器全国重点实验室,浙江杭州310027 [2]浙江大学杭州国际科创中心,浙江杭州311215 [3]浙江大学光电科学与工程学院,浙江杭州310027

出　　处：《光学学报》2024年第5期203-210,共8页Acta Optica Sinica

基　　金：国家重点研发计划:高集成三维光子器件的超分辨并行激光加工(2021YFF0502703);国家重点研发计划(2023YFF0722700);国家自然科学基金(62005120,62125504)。

摘　　要：针对双光子激光直写片上光子引线波导的纳米级对准需求,提出了基于导星数字匹配与纳米智能对准的方法,实现了高精度、高密度片上光子引线互联纳米结构3D直写加工。面向片上光子引线波导的背景与需求,设计了双光子直写光刻系统的光学系统结构,在硬件上设计了独特的导星,在算法上利用机器视觉的智能识别方法,精确定位了片上光子引线波导连接结构。所刻写的光子引线与硅片波导的平均偏差角度为0.19°,绝对位置平均对准精度为29 nm,标准差为17 nm。所提方案为实现高精度、高密度的光学片上互联提供了一种可行的方法,在芯片封装、多材料功能结构制备、复杂结构修饰等高精度加工领域有着重要的科学和应用意义。Objective Integrated photonic chip is a key technology that combines laser light sources,modulators,waveguides,detectors,and other photonic devices into a compact,high-bandwidth,low-latency,and energy-efficient package.They hold significant importance in fields such as quantum information processing and optical communication and play a crucial role in the next generation of communication systems and data interconnectivity.The two-photon polymerization technology for three-dimensional micro and nanofabrication has pushed the resolution of laser direct writing(LDW)beyond the limit imposed by optical diffraction to achieve sub-hundred nanometer scales.Meanwhile,it has significant advantages such as simple processing workflow,minimal thermal effect,and low optical threshold damage,which makes it suitable for high-precision,high-density on-chip interconnections.Additionally,the exceptional flexibility of two-photon laser direct writing systems allows for effective adaptation to the varying spatial positions,dimensions,and orientations of interfaces in on-chip interconnections,substantially reducing the requirements for active alignment.In contrast to projection lithography which processes planar structures at one time,on-chip photonic interconnections demand highprecision positioning for the three-dimensional photonic lead at the tips of the waveguides.The writing position accuracy directly influences the signal coupling quality,emphasizing the need for high-precision alignment solutions.Methods We focus on the research on nanoscale alignment techniques in high-precision laser direct writing for on-chip photonic waveguides.In the context of a two-photon three-dimensional direct writing system(Fig.1),machine vision and image processing technologies based on guide star nano-alignment are employed.Intelligent recognition and positioning of nano-alignment markers are carried out in Figs.5 and 6 to enable the definition of the processing area and the establishment of a three-dimensional processing coordinate system.The two

关 键 词：光学设计 光刻 机器视觉 片上光子引线 波导加工 双光子激光直写 

分 类 号：O436[机械工程—光学工程]