B_(4)C-TiB_(2)-SiC-TiC复合陶瓷钎焊接头微观组织与力学性能  

Microstructure and Mechanical Properties of Brazed B_(4)C-TiB_(2)-SiC-TiC Composite Ceramic Joints

作　　者：钟志宏[1,2] 袁东立 朱文静 魏仁伟 宋奎晶[1] 吴玉程[1,2] Zhong Zhihong;Yuan Dongli;Zhu Wenjing;Wei Renwei;Song Kuijing;Wu Yucheng(School of Materials Science and Engineering,Hefei University of Technology,Hefei 230009,China;Engineering Research Center of High Performance Copper Alloy Materials and Processing,Ministry of Education,Hefei University of Technology,Hefei 230009,China)

机构地区：[1]合肥工业大学材料科学与工程学院,安徽合肥230009 [2]合肥工业大学高性能铜合金材料及成形加工教育部工程研究中心,安徽合肥230009

出　　处：《稀有金属材料与工程》2024年第4期1086-1094,共9页Rare Metal Materials and Engineering

基　　金：安徽省自然科学基金(2208085ME134);科技部磁约束核聚变能发展研究专项(2015GB121003)。

摘　　要：采用Ag-Cu-Ti钎料及Ag-Cu-Ti+B_(4)C复合钎料对高性能B_(4)C-TiB_(2)-SiC-TiC(BTST)复合陶瓷进行了钎焊连接,分析了Ag-Cu-Ti钎料在复合陶瓷表面的润湿行为,研究了钎焊温度、保温时间以及B_(4)C含量对接头界面组织及力学性能的影响。结果表明:钎料对BTST复合陶瓷具有良好的润湿性,界面反应主要发生在Ti与复合陶瓷之间,反应产物主要为TiC和TiB。钎焊温度和保温时间显著影响钎焊接头的界面组织和力学性能。随着钎焊温度的提高或保温时间的延长,BTST复合陶瓷侧界面反应层逐渐增厚,钎缝组织趋向于形成Ag-Cu共晶组织,钎焊接头弯曲强度先升高后降低。随着钎料中B_(4)C含量的增加,接头中陶瓷侧反应层厚度急剧降低,钎缝区域组织得到细化,接头强度先升高后降低。当添加B_(4)C颗粒含量(质量分数)为1%,钎焊温度890℃,保温时间15 min时,钎焊接头弯曲强度最高为314.2 MPa。Ag-Cu-Ti and Ag-Cu-Ti+B_(4)C composite brazing alloys were used to braze the B_(4)C-TiB_(2)-SiC-TiC(BTST)composite ceramic.The effects of brazing temperature,holding time,and B_(4)C content on the interfacial microstructure and mechanical properties of the joints were investigated.The results show that Ag-Cu-Ti brazing alloy has a good wettability with BTST and Ti reacts with BTST to form TiC and TiB.The thickness of reaction layer increases with the increase in brazing temperature or holding time,and Ag-Cu eutectic alloy forms in the brazing seam.The bending strength of the joints increases first with the brazing temperature or holding time and then decreases.The addition of B_(4)C into the Ag-Cu-Ti refines the microstructure of brazing seam and reduces the thickness of reaction layer.The maximum bending strength of the joint achieved is 314.2 MPa,when the BTST composite ceramic is brazed at 890℃for 15 min by the Ag-Cu-Ti with 1%B_(4)C(mass fraction).

关 键 词：复合陶瓷 碳化硼 钎焊 微观组织 弯曲强度 

分 类 号：TG454[金属学及工艺—焊接]