低渗油高填充导热硅凝胶的研制  

Preparation of Thermal Conductivity Silicone Gel with Low Permeability and High Filling

作　　者：何美倩 刘珠 徐建馨 吕绍谊 潘基业 冼文琪 温燕思 赖燕怡 卓淑媛 肖若凡 沈琪力 牛粒名 刘国聪 HE Meiqian;LIU Zhu;XU Jianxin;LYU Shaoyi;PAN Jiye;XIAN Wenqi;WEN Yansi;LAI Yanyi;ZHUO Shuyuan;XIAO Ruofan;SHEN Qili;NIU Liming;LIU Guocong(Guangdong Provincial Education Department Development Team of Advanced Material Coating and Surface Interface Technology,Huizhou Engineering Technology Research Center of Advanced Coating Materials,Dayawan Chemical Engineering Research Institute of Huizhou University,School of Dayawan Chemical and New Materials,School of Chemistry and Materials Engineering,Huizhou University,Huizhou 516007,China)

机构地区：[1]惠州学院大亚湾化工新材料学院,惠州学院大亚湾化工研究院,惠州学院化学与材料工程学院,广东省教育厅先进材料涂层与表界面技术开发团队,惠州市先进涂层材料工程技术研究中心,广东惠州516007

出　　处：《有机硅材料》2024年第3期1-9,共9页Silicone Material

基　　金：广东省普通高校青年创新人才类项目(2022KQNCX081);广东省科技创新战略专项资金(“攀登计划”专项资金)(pdjh2022b0502,pdjh2023b0502);惠州市社会发展领域科技计划项目(2022CQ010006);大亚湾科技计划项目(2020020001);惠州学院教授、博士启动项目(2020JB051);大学生创新创业训练计划项目(S202110577033,S202110577034,202210577006,CX2023031);2022年惠州学院中青年教师南方科技大学访学计划(【2022】21号);广东省重点建设学科科研能力提升项目(2022ZDJS053)。

摘　　要：以200 m Pa·s和500 m Pa·s的端乙烯基硅油为基体硅油、活性氢质量分数0.05%含氢硅油为交联剂,添加不同粒径球形氧化铝以不同比例复配的导热填料制得低渗油高填充导热硅凝胶。研究了不同粒径球形氧化铝与基体硅油黏度对基胶黏度及氧化铝最大填充量的影响,探究了γ-巯丙基三甲氧基硅烷(KH590)对硅凝胶导热性能的影响,基体硅油黏度、活性氢与硅乙烯基物质的量之比及氧化铝填充量对硅凝胶硬度、密度、热导率及力学强度的影响。重点研究了氧化铝复配种类与比例对硅凝胶抗渗油性能及热稳定性的影响机制。结果表明,以不同黏度的端乙烯基硅油为基体硅油,活性氢质量分数0.05%含氢硅油为交联剂,添加不同粒径的球形氧化铝复配导热填料可制得低渗油高填充导热硅凝胶;在采用单一粒径球形氧化铝时,同一填充量下,20μm球形氧化铝对基胶的增黏不明显且最大填充量较高,可达1 500份;适当增加硅烷偶联剂KH590用量能有效提高硅凝胶的导热性能,较佳用量为2.00%;采用200 m Pa·s的端乙烯基硅油为基体硅油,活性氢与硅乙烯基物质的量之比为0.8∶1,单独采用600份20μm球形氧化铝作导热填料时,硅凝胶具有较佳的硬度、密度、热导率及拉伸强度,邵氏OO硬度为67,密度为1.83 g/cm^(3),热导率为3.69 W/(m·K),拉伸强度为1.95 MPa;采用不同粒径球形氧化铝复配时,导热硅凝胶的热导率均高于采用单一粒径球形氧化铝填充的硅凝胶,导热填料采用20μm与5μm球形氧化铝按质量比2∶1复配时硅凝胶导热性能较佳,热导率为4.72 W/(m·K);由于球形氧化铝表面硅烷化后与基体硅油的缠绕及填料表面巯基与一定量残留双键的氢键效应,导热填料采用20μm与5μm球形氧化铝按质量比2∶1复配时硅凝胶具有较佳的抗渗油性能及热稳定性,渗油比仅为1.0476,硅凝胶质量损失率5%时的温度为331℃,700℃时残余�Thermal conductivity silicone gel with low permeability and high filling was prepared by 200 mPa's(PDMS-Vi200)and 500 mPa·s(PDMS-Vi500)as silicone oil,0.05 wt%hydrogen silicone oil(PDMS-H)as cross-linking agent,and 5μm(A0-05),20μm(A0-20)and 40μm(A0-40)spherical Al_(2)O_(3)added with different ratios as heat conduction filler.The effects of spherical Al_(2)O_(3)and viscosity of PDMS-Vi on viscosity of adhesive and the maximum flling were studied.The effects of y-mercaptotrimethoxysilane(KH590)on the thermal conductivity of silicone gel,as well as viscosity of PDMS-Vi,ratios of Si-H to Si-Vi and filling amount on the hardness,density,thermal conductivity and mechanical strength of silicone gel.The influence of the type and proportion of aluminua complex ligand on the anti oil permeability and heat resistance of silicone gel was studied.The results show that the thermal conductive silicone gel has been prepared by vinyl-terminated silicone oil,0.05 wt%hydrogen silicone oil as the crosslinking agent,and spherical Al_(2)O_(3)with different particle sizes as fller.Using silicone oil with different viscosity as the base oil,0.05 wt%hydrogen silicone oil as the crosslinking agent,and spherical Al_(2)O_(3)with different particle sizes as the composite thermal conductive filler,thermal conductive silicone gel with low permeability and high flling has been prepared.When using 20μm spherical Al_(2)O_(3)with a uniform particle size,there is no obvious increase on viscosity of the gel and the maximum filling is up to 1500 phr.The appropriate amount of KH590(2.00 wt%)effectively improves the thermal conductivity of the silicone gel.When PDMS-Vi200 is used as silicone oil,the ratio of Si-H to Si-Vi is 0.8:1,A0-20 is used as thermal conductivity fller(600 phr),silicone gel has better performance,with Shore 00 hardness of 67,density of 1.83 g/cm^(2),thermal conductivity of 3.69 W/(m·K)and tensile strength of 1.95 MPa.The thermal conductivity of thermal conductive silicone gel prepared with dfferent particle sizes is higher t

关 键 词：导热 硅凝胶 低渗油 高填充 球形氧化铝 

分 类 号：TQ264.17[化学工程—有机化工]