HTCC大压力填孔工艺  

High Pressure Hole Filling Process for HTCC

作　　者：郝鹏飞 王瑞鹏 孙文涛 HAO Pengfei;WANG Ruipeng;SUN Wentao(The 2nd Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,太原030024

出　　处：《电子工艺技术》2024年第3期59-62,共4页Electronics Process Technology

摘　　要：详细介绍了HTCC工艺流程以及填孔工艺在HTCC工艺中的关键作用。通过对高黏度浆料下填孔缺陷的分析,基于常规的填孔机构设计出了一种大压力填孔机构。最后通过试验验证了大压力填孔机构的工艺可行性。The HTCC processflow and the key role of holefilling process in HTCC process are introduced in detail.By analyzing thefilling defects of high viscosity paste,a high pressurefilling mechanism is designed based on conventionalfilling mechanisms.Finally,the feasibility of the high pressure holefilling mechanism is verified by experiments.

关 键 词：HTCC 填孔缺陷 大压力 

分 类 号：TN605[电子电信—电路与系统]