功率循环试验中结温条件对IGBT器件失效模式的影响  

Influence of Junction Temperature Conditions on Failure Modes of IGBT in Power Cycling Test

作　　者：邓二平 刘鹏 吕贤亮[5] 赵雨山 丁立健 Deng Erping;Liu Peng;LüXianliang;Zhao Yushan;Ding Lijan(State Key Laboratory of High Eficiency and High Quality Electric Energy Conversion,School of Electrical Engineering and Automation,Hefei University of Technology,Hefei 230009,China;Institute of Energy,Hefei Comprehensive National Science Center,Hefei 230051,China;NARI Group(State Grid Electric Power Research Institute)Corporation,Nanjing 211106,China;Nanjing NARI Semiconductor Co.,Lid.,Nanjing 211100,China;China Electronics Standardization Institute,Beijing 100176,China)

机构地区：[1]合肥工业大学电气与自动化工程学院电能高效高质转化全国重点实验室,合肥230009 [2]合肥综合性国家科学中心能源研究院,合肥230051 [3]南瑞集团(国网电力科学研究院)有限公司,南京211106 [4]南京南瑞半导体有限公司,南京211100 [5]中国电子技术标准化研究院,北京100176

出　　处：《半导体技术》2024年第6期580-588,共9页Semiconductor Technology

基　　金：国家自然科学基金青年科学基金(52007061)。

摘　　要：为了探究功率循环试验中结温条件对绝缘栅双极型晶体管(IGBT)器件失效模式的影响及其失效机理,以理论分析为出发点,通过大量功率循环试验进行对比验证,基于瞬态热阻抗曲线建立了准确的三维有限元模型,并仿真分析了相关失效机理。仿真及试验结果表明,键合线失效只受结温波动的影响;焊料老化受结温波动和最大结温的影响。增加结温波动会增加键合线、焊料所受应力,而提高最大结温会影响焊料的材料特性,加速其蠕变过程。研究成果解决了解析寿命模型难以表征失效机理的问题,并为失效模式的分离提供新的研究思路。In order to explore the influence of junction temperature conditions on the failure modes of insulated gate bipolar transistors(IGBTs)and failure mechanisms in power cycling test,starting from the theoretical analysis and conducting comparative verification through a large number of power cycling tests,an accurate three-dimensional finite element model was established based on the transient thermal impedance curve.The relevant failure mechanisms were simulated and analyzed.Simulation and test results show that bond wires failure is only affected by junction temperature fluctuation.The solder aging is affected by junction temperature fluctuation and maximum junction temperature.Increasing the junction temperature fluctuation will increase the stress on the bond wires and solder,while increasing the maximum junction temperature will affect the material properties of the solder and accelerate its creep process.The research results solve the problem that it is difficult to characterize the failure mechanism using analytical lifetime model,and can provide new research ideas for the separation of failure modes.

关 键 词：结温波动 最大结温 失效模式 有限元仿真 功率循环试验 

分 类 号：TN386[电子电信—物理电子学] TN306