KMnO_(4)-H_(2)SO_(4)-H_(2)O体系对聚碳酸酯的表面微蚀  

Etching of Polycarbonate Surface by KMnO_(4)-H_(2)SO_(4)-H_(2)O System

作　　者：刘利利 张彩芳 赵文霞 宋晅 程熠 朱皓 LIU Lili;ZHANG Caifang;ZHAO Wenxia;SONG Xuan;CHENG Yi;ZHU Hao(College of Chemistry and Chemical Engineering,Ningxia Normal University,Guyuan 756099,China)

机构地区：[1]宁夏师范学院化学化工学院,固原756099

出　　处：《腐蚀与防护》2024年第5期44-48,共5页Corrosion & Protection

基　　金：宁夏高等学校一流学科建设(教育学学科)项目(NXYLXK2017B11);宁夏自然科学基金(2022AAC03298);国家自然科学基金项目(21561027);宁夏科技创新领军人才项目(KJT2016004);自治区重点研发计划一般项目(2018BEE03024);宁夏青年拔尖人才“国家级学术技术带头人后备人选”项目(宁人社函〔2017〕787号);宁夏新型高校智库项目(宁教工委办[2018]12号);固原市科技计划项目(2020GYKYF003);宁夏师范学院六盘山资源工程技术研究中心项目(HGZD20-02,HGZD21-04);无机化学重点学科项目(宁师院[2017]83号)。

摘　　要：为了提高聚碳酸酯(PC)与镀层间的黏结强度,采用KMnO_(4)-H_(2)SO_(4)-H_(2)O体系对PC进行表面微蚀处理,然后在其表面制备了铜镀层。通过扫描电镜、视频光学接触角测量仪和万能材料试验机研究了体系中硫酸体积分数和微蚀时间对PC表面形貌、亲水性,PC与铜镀层间黏结强度的影响。结果表明:采用KMnO_(4)-H_(2)SO_(4)-H_(2)O体系对PC基体进行合适的表面微蚀处理后,PC基体表面呈现出优异的表面粗糙度和亲水性,并且铜镀层与基体结合牢固;在微蚀温度为70℃、KMnO_(4)质量浓度为6 g/L、硫酸体积分数为71.0%条件下,微蚀25 min后,PC基体表面形成了大量致密均匀的微孔,表面粗糙度增大,为化学镀铜过程中铜的沉积提供了良好的定位点,并且PC基体表面接触角由83.5°降低到53.7°,亲水性大幅度增强,黏结强度达到最大值,为4.1 N/cm。In order to improve the surface adhesion strength between polycarbonate(PC)and coating,the surface of PC was etched by KMnO_(4)-H_(2)SO_(4)-H_(2)O system,and copper coating was prepared on PC surface.The effects of sulfuric acid volume fraction and etching time on the surface morphology,hydrophilicity and adhesion strength between PC and copper coating were studied by scanning electron microscopy,video optical contact angle measuring instrument and universal material testing machine.The results show that the PC substrate obtained excellent surface roughness and hydrophilicity after etching by KMnO_(4)-H_(2)SO_(4)-H_(2)O system.At the same time the copper coating was firmly bonded with the substrate.After the PC was etched for 25 min under conditions of 70℃,6 g/L KMnO_(4)and volume fraction of sulfuric acid of 71.0%,a large number of dense and uniform micropores were formed on the surface of PC substrate,and the surface roughness of PC increased,which provided a good fixing point for copper deposition during electroless copper plating.Moreover,the contact angle of PC surface was reduced from 83.5°to 53.7°,the hydrophilicity was greatly enhanced,and the adhesion strength reached a maximum of 4.1 N/cm.

关 键 词：聚碳酸酯 膨润 微蚀 高锰酸钾 

分 类 号：TQ153[化学工程—电化学工业]