机车牵引控制单元控制芯片热分析及仿真  

Thermal Analysis and Simulation of Locomotive Traction Control Unit Control Chip

作　　者：丁馨楠 王文奇 朱振新 李彬 孙晨光 DING Xin-nan;WANG Wen-qi;ZHU Zhen-xin;LI Bin;SUN Chen-guang(CRRC Dalian Electric Traction R&D Center Co.,Ltd.,Liaoning Dalian116000,China;Dalian Metro Operation Co.,Ltd.,Liaoning Dalian116000,China;China Railway Beijing Group Co.,Ltd.,Beijing100860,China)

机构地区：[1]中国中车大连电力牵引研发中心有限公司,辽宁大连116000 [2]大连地铁运营有限公司,辽宁大连116000 [3]中国铁路北京局集团公司,北京100860

出　　处：《机电产品开发与创新》2024年第3期101-103,共3页Development & Innovation of Machinery & Electrical Products

摘　　要：本文对机车牵引控制单元核心控制电路板卡上高速处理器芯片进行散热设计和仿真研究,并对不满足散热需求的热设计进行改进。通过对比热仿真结果和实际应用环境下的芯片温升,充分验证了热仿真对散热设计具有指导意义。This article conducts heat dissipation design and simulation research on the high-speed processor chip on the core control circuit board of the locomotive traction control unit,and improves the thermal design that does not meet the heat dissipation requirements.By comparing the simulation results of specific heat and the temperature rise of chips in practical application environments,it is fully verified that thermal simulation has guiding significance for heat dissipation design.

关 键 词：芯片 散热 仿真 

分 类 号：TP39[自动化与计算机技术—计算机应用技术]