聚合物微针阵列热压印成型仿真与试验研究  

Simulation and experimental research on the hot embossing of polymer microneedle arrays

作　　者：成钢 唐昆[2] 刘冠中 刘子聪 袁剑平 胡永乐[2] 毛聪[2] CHENG Gang;TANG Kun;LIU Guanzhong;LIU Zicong;YUAN Jianping;HU Yongle;MAO Cong(Jianglu Electromechanical Group Co.,Ltd.,Xiangtan 411100,China;Hunan Provincial Key Laboratory of Intelligent Manufacturing Technology for High-performance Mechanical Equipment,Changsha University of Science&Technology,Changsha 410114,China)

机构地区：[1]江麓机电集团有限公司工艺研究院,湖南湘潭411100 [2]长沙理工大学机械装备高性能智能制造关键技术湖南省重点实验室,湖南长沙410114

出　　处：《长沙理工大学学报（自然科学版）》2024年第2期68-76,共9页Journal of Changsha University of Science and Technology:Natural Science

基　　金：国家自然科学基金资助项目(51405034);江麓机电集团有限公司技术质量攻关类项目(220029);长沙市自然科学基金资助项目(kq2202200)。

摘　　要：【目的】针对聚合物微针阵列热压印成型过程中充型不完整、脱模后继续变形和应力集中等问题,将成型仿真与试验相结合,探究热压印成型参数对残余应力与平均填充深度的影响,以满足高精度批量制造聚合物微针阵列的需求。【方法】在聚合物材料热-机械性能研究的基础上,建立微针阵列的有限元模型,分析热压印温度、热压印速率和下压量等成型参数对残余应力及其分布的影响,进行热压印成型试验,探讨相关成型参数对微针成型的影响,对比分析了平均填充深度仿真与试验值。【结果】随热压印温度的升高,最大成型应力呈先降后升的趋势;随热压印速率与下压量的增加,最大成型应力均呈增大的趋势;除热压印温度高于125℃之外,平均填充深度的仿真值与试验值变化趋势一致,且仿真值均高于试验值。此外,还获得了适用于聚苯乙烯微针阵列的最佳热压印参数,即热压印温度125℃、热压印速率10μm/s、下压量2.6 mm。【结论】在一定温度范围内,该数值仿真结果具有较高的指导意义,聚苯乙烯微针阵列结构的残余应力与平均填充深度具有较为敏感的温度与时间相关性。[Purposes]Aiming at the problems of incomplete filling,continuous deformation,and stress concentration in the hot embossing of polymer microneedle array,the influence of embossing parameters on the residual stress and the average filling depth is explored by the combination of simulation and experiments to meet the demand of high-precision batch manufacturings.[Methods]Based on the study of thermo-mechanical properties of polymer materials,the finite element model of microneedle array is established,and the effects of embossing temperature,rate and amount on the residual stress and its distribution are analyzed.In addition,hot embossing experiments are carried out.The influence of the above molding parameters on the microneedle filling,and the comparison between the simulation and the experimental values of the average filling depth are also discussed.[Findings]The results show that the maximum forming stress decreases first and then increases with the increase of embossing temperature,while the maximum forming stress increases with the rise of embossing rate and amount.The simulation values of the average filling depth are consistent with the experimental ones except when the embossing temperature is higher than 125℃,and all simulated values are greater than the experimental ones.In addition,the optimal parameters,that is,the embossing temperature of 125℃,the embossing rate of 10μm/s and the embossing amount of 2.6 mm,are obtained.[Conclusions]The numerical simulation results are highly instructive in a certain temperature range.The residual stress and the average filling depth of the polymer microneedle array structure have some sensitive temperature and time correlations.

关 键 词：聚合物 微针阵列 热压印 有限元仿真 填充深度 

分 类 号：TH128[机械工程—机械设计及理论] TH164