Cu_(50)Ni_(50)合金凝固过程中的空位捕获  

Vacancy trapping during solidification of Cu_(50)Ni_(50) alloy

作　　者：张伯阳 汪昊 周涛 吴永全[1,2,3] ZHANG Boyang;WANG Hao;ZHOU Tao;WU Yongquan(School of Materials Science and Engineering,Shanghai University,Shanghai 200444,China;State Key Laboratory of Advanced Special Steel,Shanghai University,Shanghai 200444,China;Shanghai Key Laboratory of Advanced Ferro Metallurgy,Shanghai University,Shanghai 200444,China)

机构地区：[1]上海大学材料科学与工程学院,上海200444 [2]上海大学省部共建高品质特殊钢冶金与制备国家重点实验室,上海200444 [3]上海大学上海市钢铁冶金新技术开发应用重点实验室,上海200444

出　　处：《上海大学学报（自然科学版）》2024年第2期267-277,共11页Journal of Shanghai University:Natural Science Edition

基　　金：国家自然科学基金资助项目(52074178,51374141)。

摘　　要：通过分子动力学(molecular dynamics,MD)模拟,研究了Cu_(50)Ni_(50)合金在不同温度下凝固及其退火过程的空位捕获.结果发现:凝固过程中的空位捕获效应,即被捕获空位浓度的过饱和现象非常明显;随着凝固温度的降低,空位浓度显著上升,与平衡浓度随温度的变化规律正好相反;Cu_(50)Ni_(50)存在一个特征温度T∗,在T>T∗浅过冷温度下,凝固速度随着凝固温度的降低快速增加,在T<T∗深过冷温度下,凝固速度随着凝固温度的降低缓慢下降,表明空位浓度并不是界面生长速度的单值函数;作为合金元素,Cu比Ni更倾向于形成空位原子(vacancy atom,VA).Molecular dynamics(MD)simulation was used to investigate the vacancy trapping during the solidification and annealing processes of Cu_(50)Ni_(50) at different temperatures.The results showed that the vacancy trapping effect was very evident and the vacancy concentration significantly increased with the decrease in temperature,opposite to the law that the equilibrium concentration changes with temperature.There was a characteristic temperature T∗for which the solidification rate rapidly increased with the decrease of temperature at shallow undercooling when T>T∗but decreased slowly at deep undercooling when T<T∗,indicating that the vacancy concentration was not a monotonic function of the interface moving rate.In addition,as an alloy constituent,Cu was found to be a better vacancy atom(VA)than Ni.

关 键 词：分子动力学模拟 空位捕获 凝固温度 Cu_(50)Ni_(50)合金 

分 类 号：TG111.2[金属学及工艺—物理冶金]