中温固化有胶挠性覆铜板的研制  

Study on preparation of mid-temperature curing FCCL with adhesive

作　　者：左陈 陈兰香 曾令辉[1] ZUO Chen;CHEN Lanxiang;ZENG Linghui(National Engineering Research Center of Electronic Circuits Base Materials,Shengyi Technology Co.,Ltd.,Dongguan 523808,Guangdong,China)

机构地区：[1]广东生益科技股份有限公司国家电子电路基材工程技术研究中心,广东东莞523808

出　　处：《印制电路信息》2024年第5期40-43,共4页Printed Circuit Information

摘　　要：研究了一种中温固化有胶挠性覆铜板(FCCL)的配方及工艺,并考察了E-51环氧树脂、多官能环氧树脂对FCCL性能的影响。研究结果表明,在配方中添加E-51环氧树脂可以有效提高胶黏剂的流动性,从而改善涂胶聚酰亚胺(PI)膜的压合性,减少压合铜箔后所产生的气泡,但是配方中添加E-51环氧树脂会缩短胶水的适用期;当多官能环氧树脂用量超过15%时,固化后的胶黏剂脆性变大,当固化温度≥90℃时,FCCL的性能趋于稳定。对比测试结果表明,制备的中温固化FCCL的基本性能与生益科技常规产品SF305基本相当,可满足挠性印制电路板(FPCB)的应用要求。This article studies the formula and process of a mid⁃temperature curing flexible copper clad laminate with adhesive(3L-FCCL).The influence of E-51 epoxy and multi-functional epoxy on the 3L-FCCL is also investigated.The result shows that E-51 epoxy can help to improve the fluidity of the adhesive and reduce the bubble occurrence of coating PI film after being covered with copper foil.The adhesive becomes brittle when the multi-functional epoxy is added more than 15%in the formula.The curing degree of adhesive could be improved by raising curing temperature.The performance of 3L-FCCL tends to be stable when curing temperature exceeds 90℃.The comparison test result shows that the mid-temperature curing 3L-FCCL has the basic performance equivalent to that of SF305 which is the conventional product of Shengyi Technology Co.,Ltd.and can meet the application requirement of FCCL.

关 键 词：挠性覆铜板(FCCL) 中温固化 环氧树脂 剥离强度 耐热性 

分 类 号：TN41[电子电信—微电子学与固体电子学]